Abstract: This invention relates to the fabrication and assembly of semiconductor chips, substrates, and modules, and more particularly to methods and apparatus for achieving flexible, low-cost manufacturing. Commercial and military systems today are placing increasing demands on flexible application and reliable operation, as well as on simplified manufacturing.

Abstract: A method of using a single-headed bonder (80) to form bonds to bond pads (16) is provided. A single-headed bonder (80) includes a capillary (22) having a capillary face (40) with a long dimension along a first axis (BB) and a short dimension along a second axis (CC). The long dimension of the capillary face (40) is aligned in a first orientation such that the bond pads (16) are bonded in a first direction associated with the first orientation. The capillary (22) is then rotated to place the long dimension in a second orientation such that all the bond pads (16) are bonded in a second direction associated with the second orientation. In place of rotating the capillary (22), a second single-headed bonder (90) having a capillary (22) rotated to the second orientation can be used to bond bond pads (16) in the second direction. Transportation between bonders can be done manually, by a transport mechanism (60), by a robotic arm (70), or other suitable means.