Patents Represented by Attorney Neil A. Seinberg

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  • Temperature compensation for silicon MEMS resonator
    Patent number: 6987432
    Abstract: Thermally induced frequency variations in a micromechanical resonator are actively or passively mitigated by application of a compensating stiffness, or a compressive/tensile strain. Various composition materials may be selected according to their thermal expansion coefficient and used to form resonator components on a substrate. When exposed to temperature variations, the relative expansion of these composition materials creates a compensating stiffness, or a compressive/tensile strain.
    Type: Grant
    Filed: April 16, 2003
    Date of Patent: January 17, 2006
    Assignee: Robert Bosch GmbH
    Inventors: Markus Lutz, Aaron Partridge