Abstract: A device including a first solder pad and a second solder pad comprised of a post-soldering alloy composition on a substrate is provided. The alloy composition comprises two or more elements, and the post soldering alloy composition of the first solder pad has different amounts of the two or more elements than the alloy composition of the second solder pad. A method of making a solder pad comprises masking a substrate comprising at least a first solder pad and a second solder pad, wherein the mask exposes a greater area of the first solder pad so that the deposited element becomes part of an alloy composition of the first solder pad upon soldering thereby changing the melting point of the first solder pad.

Abstract: A method for constructing an optical switch and the switch constructed thereby are described. An optical switch having a pair of chips is assembled with a plurality of optical fibers mounted on the chips such that endfaces of the fibers extend beyond ends of the chips. The optical fibers may be mounted by adhering them to the chips. The endfaces of the fibers and the front surfaces of the chips are then polished to provide coplanar surfaces which are good optical couplers. The chips are then etched with an etchant material which is ineffective at etching the optical fibers. The chips may include a coating which is resistant to the etchant material.

Abstract: An assembly and a method for accurately aligning optical fibers in an optical switch are described. An optical switch assembly is described having a pair of optical arrays mounted on a mounting apparatus. The mounting apparatus may include a base structure with either integral rails or affixed fibers. Alternatively, the mounting apparatus may include a base structure with grooves and a plurality of spheres in the grooves. An alternative arrangement includes a base structure with some grooves extending transverse to other grooves and mounting structures in each groove. One of the optical arrays is rendered immobile while the other array is freely movable on the mounting apparatus. Switching is provided by moving the movable fiber array relative to the fixed fiber array.

Abstract: The present invention provides an optical switch. The switch includes a substrate and a first waveguide holding member. The switch also includes a second waveguide holding member disposed over the substrate and movable relative to the first waveguide holding member to provide a switching function. A movement guiding member is provided for guiding the movement of the second waveguide holding member. A registration element is disposed at the movement guiding member for positioning the second waveguide holding member at a selected location relative to the first waveguide holding member. The selected location is one that provides alignment between a selected waveguide of the first waveguide holding member and a selected waveguide of the second waveguide holding member.

Abstract: An optical fiber switch having two coupled fiber arrays which move in a transverse direction to provide switching action. Each array has a front face and the front faces are nearly in contact. Optical fiber ends are located at the front faces. The front faces of the fiber arrays have transverse grooves in which rolling spheres are disposed. The fiber arrays move by rolling on the spheres. The spheres provide for smooth transverse motion and a fixed distance between optical fiber arrays. The spheres and front face grooves also provide for alignment between the optical fibers.

Abstract: An optical switch includes a first wavedguide holding member and a second waveguide holding member disposed on a substrate. The first waveguide holding member moves relative to the second waveguide holding member. A movement guiding member guides the motion of the first waveguide holding member and the substrate. Advantageously, the first waveguide holding member moves transversely relative to the second waveguide holding member. The traverse motion enables selective coupling between a waveguide in the first waveguide holding member and a waveguide in the second holding member. Through this transverse motion of the second waveguide holding member, an optical switching action may be implemented.

Abstract: An optical switch and method for assembling are described. Optical arrays are mounted on a flex plate with an interface between them. The direction of certain forces on the flex plate allows coupling/decoupling of the optical arrays. The flex plate includes an area which exhibits a different flex profile than the remainder of the flex plate and that is located beneath the optical arrays interface. Flexing of the flex plate optically couples the optical arrays. A tool with grooves is used to align the optical arrays relative to each other. The tool uses grooves and spheres to mate with the optical arrays in such a way as to provide an appropriate interface between the optical arrays.

Abstract: An optical switch is provided for selectively coupling outputs of one or more fibers of a first array to one or more inputs of fibers of a second array. The first array includes a first groove disposed within a front face of the first array. The second array optionally includes a second groove disposed within a front face of the second array. The first and second fiber arrays are oriented so that their respective front faces are disposed in a facing relationship. A roller element is located within at least the first groove, permitting the first array to translate relative to the second array upon the roller element along the direction of the first groove. In addition, detents may be formed within the grooves of each array to create areas in which the roller element may at least temporarily seat. The location and number of detents are arranged to correspond to the location and number of rows of fibers in the respective arrays.

Abstract: A fiber array is provided for use in optical systems requiring a one-dimensional or two-dimensional array of fibers. The fiber array includes a support post disposed within a fiber-containing cavity of the fiber array to provide support within the internal cavity. The use of the support post permits the height of the fiber array to be reduced thereby enabling such fiber arrays to be stacked together more closely providing increased fiber packing density among arrays. In addition, the fiber array is configured to support and protect un-jacketed fibers, where the absence of the jacket permits increased packing density among fibers in an individual fiber array.

Abstract: In an integrated optical waveguide device including a first top portion on the substrate, and a plurality of juxtaposed waveguide cores within cladding layers on a second top portion of the substrate, the waveguide cores having respective inner endfaces parallel to a longitudinal open slotway formed in the substrate between the first and second top portions, the substrate being undercut from the slotway to produce a cantilevered section of the waveguide cores and cladding layers, for permitting the plurality of waveguide cores and associated cladding layers to be simultaneously cleaved, thereby providing a smooth endface thereacross.

Abstract: A method of fabricating optical filter is disclosed. The method includes providing the substrate and selectively etching the substrate to form a plurality of freestanding layers. A plurality of dielectric layers is disposed over an outer surface of each of the freestanding layers. The resultant optical filters may be used in a variety of applications including etalon applications.

Abstract: The same mask pattern is used as an etching mask in defining the horizontal location of micro-machined (etched) features at the substrate surface of an optical device relative to the waveguide cores also at the substrate surface of the optical device. Exemplary micro-machined features include grooves, recesses and inclined surfaces formed in the substrate surface for any of a variety of purposes. The accurate horizontal positioning of these features relative to the integrated waveguide cores fosters accurate optical coupling between the integrated waveguide cores and external and/or internal components.

Abstract: A first waveguide holding member has a first transverse surface region and a first optical waveguide having an end terminating at the first transverse surface region. A second waveguide holding member has a second transverse surface region which confronts the first transverse surface region of the first waveguide holding member and a second optical waveguide having an end terminating at the second transverse surface region. A guide member is operatively coupled to the first and second waveguide holding members and guides the first waveguide holding member in a transverse direction relative to the second waveguide holding member so as to selectively optically couple and decouple the ends of the first and second optical waveguides.

Abstract: An optical fiber pressure sensor having a base layer 20 with an optical fiber hole, a fiber stop layer 28 and, optionally, an etch stop layer 24. The fiber stop layer optionally has a fiber stop hole 33 that is smaller than the optical fiber 22. A diaphragm cap layer 32 is bonded to the fiber stop layer 28. The diaphragm cap layer 32 has a diaphragm 34 spaced apart from the optical fiber. The optical fiber and diaphragm form an Etalon that changes cavity length with applied pressure. Optionally, the device is made almost entirely of silicon, and so has reduced mechanical stress problems caused by thermal expansion mismatches. This allows the present sensor to be used in high temperature environments such as internal combustion engines.

Abstract: A 2-dimensional optical fiber array having stacked sticks with fibers disposed between the sticks. The sticks are made by directional dry etching. The shape of the sticks is defined by a lithographic mask. Each stick has notches for holding the optical fibers. Since the sticks are defined by a lithographic mask, the fibers are accurately located in the 2-D array. In a alternative embodiment, the sticks are made by dry etching holes in a wafer, and then cleaving the wafer into sticks. To make the array. Fibers are disposed between the sticks and the sticks are reassembled so that cleaved surfaces are rejoined. Also, double-sided sticks can be made from a wafer having an etch stop layer. Directional dry etching is performed from both sides of the wafer.

Abstract: Surface micromachined structures having a relatively thick silicon nitride layer and a relatively thin conductive polysilicon layer bonded together. Preferably, the silicon nitride layer and conductive polysilicon layer are made in the same low pressure chemical vapor deposition (LPCVD) step. The polysilicon layer is thin enough compared to the silicon nitride layer so that the mechanical properties of the microstructure are primarily determined by the silicon nitride layer. This provides superior mechanical properties for many applications. The thin conductive polysilicon layer provides conductivity for the microstructure (silicon nitride is an electrical insulator). The polysilicon layer has a thickness less than ⅕ the thickness of the silicon nitride layer. Preferably, the polysilicon layer is much thinner than this. The polysilicon layer can be located on a top surface or bottom surface of the silicon nitride layer. Also, the polysilicon layer can be located within the silicon nitride layer.