Abstract: A thermal head for a thermal-transfer or heat-sensitive printer has a silicon substrate having a projection. A porous silicon layer having a small thermal conductivity is formed on the silicon substrate so as to cover at least the projection on the silicon substrate. A heat-generating resistor layer is formed on the porous silicon oxide layer in a region above the projection of the silicon substrate. A conductor layer is formed on the heat-generating layer so as to expose the portion of the heat-generating resistor layer which is right above the projection of the silicon substrate and which serves as a heat-generating portion. The heat-generating portion and the conductor layer are covered by a protective layer.