Patents Represented by Attorney Norman H. Spain
  • Patent number: 6040066
    Abstract: A rewritable optical information medium has a phase-change recording layer (3) on the basis of an alloy of Ge-Sb-Te-O, having the composition (Ge.sub.a Sb.sub.b Te.sub.c).sub.1-d O.sub.d, wherein:a+b+c=10.0001 a d a 0.035The addition of oxygen considerably speeds up the crystallization rate of Ge-Sb-Te materials. Such a medium is suitable for high speed recording (i.e. at least eight times the CD-speed), such as for DVD-RAM and optical tape. The amount of oxygen in the recording layer (3) can be used to tune the crystallization rate to the desired value.
    Type: Grant
    Filed: December 7, 1998
    Date of Patent: March 21, 2000
    Assignee: U.S. Philips Corporation
    Inventors: Guo-Fu Zhou, Bernardus A.J. Jacobs, Johannes C.N. Rijpers, Hermanus J. Borg
  • Patent number: 4582535
    Abstract: An Invar type alloy on the basis of iron is formed by an intermetallic compound having a cubic crystal structure of the NaZn.sub.13 type having a nominal composition La(FeCoX).sub.13, wherein X is Si or Al. By subjecting the present intermetallic compound after melting to a tempering treatment at 800.degree.-1,000.degree. C. and cooling it in an accelerated manner, a brittle material is obtained which can be ground to form a powder. From this powder, articles having any desired (optionally complicated) shape can be produced by means of powder metallurgy. By mixing powders of two different intermetallic compounds, a material can be obtained having a substantially negligible coefficient of linear thermal expansion in the temperature range from 0.degree. C. to 200.degree. C.
    Type: Grant
    Filed: February 14, 1985
    Date of Patent: April 15, 1986
    Assignee: U.S. Philips Corporation
    Inventor: Kurt H. J. Buschow
  • Patent number: 4332342
    Abstract: A method of and a device for soldering components on thick-film substrates according to the reflow method. Successively, the substrates are preheated, followed by heating to the soldering temperature, after which they are cooled. A wave of molten metal of a given temperature is used for preheating, heating and cooling of the substrates.
    Type: Grant
    Filed: March 23, 1981
    Date of Patent: June 1, 1982
    Assignee: U.S. Philips Corporation
    Inventor: Henricus C. A. van Der Put