Abstract: A dual-switch transformer-coupled switching regulator is provided with a non-dissipative snubber circuit arrangement wherein the resonant elements thereof include an inductor serially connected between two capacitors through a diode switch. The snubber has two other diode switches that are connected on mutually exclusive ones of the same sides of the capacitors that are connected to the inductor. Each of the last two mentioned diode switches connects the respective aforementioned side of the particular capacitor to the outer main terminal of a mutually exclusive one of the dual transistor switches of the regulator. The other side of the particular capacitor is connected to the other main terminal of the other one of the dual transistor switches. The arrangement minimizes any deleterious effects caused when the dual switches are being switched.

Abstract: An elongated member is provided in the discharge orifice of a spray head nozzle so that the fluid being sprayed is discharged as a hollow stream resulting inter alia in a better and more complete atomization of the fluid in coaction with a low pressure propellant.

Abstract: In a field-accessed magnetic domain device package assembly, the magnetic domain device carrier or support, the circuit line or conductor carrier, and the magnetic bias field source are integrally and coactively provided by a common substrate member. The member is a planar permanent magnetic insulator ceramic and carries a bonded conductor or wiring pattern. The input/output (I/O) terminals of the domain device, also referred to in the art as a chip, are selectively bonded to the conductors of the pattern thereby providing mechanical support of the chip directly to the substrate in a superimposed relationship, input/output electrical connection to the chip, and mounting of the chip in close proximity to the bias field source, the flux of which passes through the superimposed mounted chips to a high permeability member at least part of which is disposed on the opposite side of the chip.

Abstract: A laminate for a laminated multilayer circuit board incorporates as a constituent member the plating layer from a peel-apart temporary base used in the fabrication of the laminate. The layer, with its one surface superimposed on the base, has additively plated to its opposite surface individual conductors and is subsequently personalized in register with the pattern of the plated conductor circuitry. The personalized layer and the plated conductors are embedded in a dielectric layer, the superimposed surface being flush mounted in the dielectric layer. The base has a rough-like surface profile characteristic that imparts at least a conformal surface profile characteristic in the superimposed surface of the plating layer which in turn provides improved adherence of this superimposed flush mounted surface, when subsequently exposed by the removal of the peel-apart base, to another dielectric layer thereafter laminated to the embedding dielectric layer to inhibit delamination between the two dielectric layers.

Abstract: A Hall effect package structure is provided with a cap which carries integral reference plane establishing members for establishing the gap between the facing ends of two elongated flux concentrator members in which a semiconductor chip having at least one Hall effect region is located. A pair of demountable C-shaped flux concentrator members engage therebetween the remote ends of the elongated flux concentrator members.

Abstract: A method for making an electronic package assembly of the type having an insulator pin carrier, a thin, i.e. substantially five microns, flexible printed circuit (PC) polyimide member having printed circuit conductors bonded to the heads of the pins of the carrier, and one or more integrated circuit (IC) chips with a high density (i.e. 100 or more) input/output I/O terminal array on the bottom surface of each chip bonded to a corresponding registerable array of PC conductor pads of the polyimide member. The forming, curing and circuitizing of the polyimide member, the bonding of the I/O terminals to the pads of the PC member, and the bonding of the pin heads to the PC member are done on a temporary support or fixture. The method provides a reliable manner for fabrication of the package assembly which minimizes the risk of destroying the flexibility of the PC member and/or its integrity during the making of the assembly and/or the subsequent thermal cycling associated with the assembly.

Abstract: Field accessed magnetic domain device apparatus, of the kind which employs an inner and an encompassing outer solenoid as the rotational magnetic field orthogonal drive coil members with the magnetic domain device(s) mounted within the inner solenoid, has conductive shield means disposed within the inner solenoid between the device(s) and the solenoids. This results in a substantially uniform flux distribution which passes through the inner solenoid and/or mitigation of the adverse effects of the stray flux between turns of the solenoids. As a consequence, a substantially uniform rotational magnetic field distribution is provided in the active area for the device(s), generally referred to as magnetic bubble device(s) or chip(s).

Abstract: Plural groups of one or more magnetic domain devices each are mounted in an array on the circuitized surface of a common substrate. A rectangular pattern of slots is provided in the substrate around each group. Each group is encompassed through the slots by the turns of the inner and outer orthogonal solenoids of its own exlusive rotational magnetic field drive system and permanent magnet bias field closed structure. Each device has a pattern of I/O pads located on its undersurface which are bonded to a corresponding pattern of terminal pads which are part of the circuitized surface of the substrate. The interconnecting signal lines to the terminal pads of the substrate pass through one or more of the four intersection corners formed between the slots of the rectangular pattern. Preferably, the substrate also accommodates integrated circuit modules and/or other components mounted thereon which are associated with the drive, sense and other support circuitry for the magnetic domain devices.

Abstract: Pre-twisted multiple wires having N twisted sections per full-twist pitch, where N is a predetermined constant integer, are juxtaposed to a roller which carries plural conformal seat means in a circumferential manner. The arcuate spacing between adjacent seat means is correlated with 1/Nth of the full-twist pitch of the particular twisted wires. Associated with the roller is ratchet means which allows the roller to be indexable in increments correlated with a full-twist pitch of the particular multiple twisted wires. As a result, the twisted wires are fed out in full-twist linear increments and, hence, with the same orientation of the wires for each incrementing step. Moreover, by judiciously seating one of the N possible adjacent twist sections of the twisted wires with respect to the seat means, the twisted wires can be fed out selectively with N possible orientations.

Abstract: The radiation absorber system of a unidirectional spiral antenna is provided with a laterally transverse variable radiation absorption density characteristic to control the absolute gain with frequency pattern, i.e. absolute gain versus frequency characteristic, of the antenna.

Abstract: An electrical interconnector is formed of discrete laminate members. The basic configuration has a printed circuit substrate member interleaved between two ground plane members. Predetermined first and second printed circuit conductor patterns are on opposite sides of the printed circuit substrate, each interacting as a signal plane with the particular one of the ground plane members that is juxtaposed to it. The two patterns are interconnected by severable conductive means located at one or more predetermined locations across at least one edge of the substrate. Programmability is effected by severing one or more of the conductive means in the desired interconnection pattern. The basic configuration when arrayed with other similar basic configurations provides modular construction. Each basic configuration, hereinafter referred to sometimes as a section, in the array is separated from its adjacent section by another laminate member which is an insulator.

Abstract: Plural first and second mating members are simultaneously interconnected in mutually exclusive pairs by apparatus which includes a cam mechanism that in addition self-relieves any undesirable stresses when present in the apparatus as a result of interconnecting the plural mating members. In the preferred embodiment, the mating members are male electrical connector pins and co-acting female bifurcated spring type connectors.

Abstract: Plural sample container holders, each of which is capable of carrying a plurality of sample containers, are carried in a box-like magazine. The sample handling system, has an incrementably operable first conveyor that conveys the loaded magazines. Intersecting the first conveyor at a given location is a second incrementably operable conveyor which is adapted to access, i.e. withdraw and insert holders, through an access of the magazine and to convey withdrawn holders to and from a sample work station and back to the given location. The second conveyor carries a protruding member which co-acts with a cooperative engageable member carried by each holder. When the holders are being carried by the magazine, their respective cooperative engageable members are in alignment, the magazine being adapted to expose the so aligned cooperative members of the holders.

Abstract: A pickup head, which is of the type referred to in the art as a Bernoulli pickup head, is used to lift and/or transport a semiconductor wafer. The head is provided with a central positive pressure gas coupled orifice or port and at least three auxiliary positive pressure gas coupled orifices disposed symmetrically about the central orifice. The gas flow from the central orifice effects the main lifting force and the gas flow from the auxiliary orifices effects additional restoring torque to correct for any wafer tilt, if present. Thus, the integrity of the non-contacting relationship between the head and wafer surface is enhanced and/or preserved and this is particularly advantageous on lift-off.

Abstract: Two terminals are disposed on the body of an electrical component such that each terminal is adapted to be in contact with an exclusive one of a pair of circuit interconnection terminals whenever the body is oriented in a first direction with respect to the two interconnection terminals. One of the two component terminals is further adapted to be in contact with both circuit interconnection terminals whenever the body is oriented in a second direction with respect to the two interconnection terminals. As such, in the first direction the component is electrically operable in the associated circuit, and in the second direction the component is bypassed.

Abstract: Positioning apparatus is disclosed which positions an object with respect to two predetermined lateral positions. In addition, the object is indexable by the apparatus in a step-by-step manner in an incidental direction with respect to each of the two lateral positions. It includes an endless sprocket chain entrained about two sprocket wheels. The chain carries a first member which is pivotably connected to the chain. A second member is affixed to the first member and is adapted to support the object. The second member is slidably mounted to a movable third member which in turn is guided by guiding means such as rails that guides the third member means in a predetermined aligned relationship with the reaches of the chain. In addition, chain guide means guide the chain along the first and second reaches. Driver means are coupled to one of the sprocket wheels to drive the endless chain.

Abstract: A spectrum analyzer is disclosed which is of the type that utilizes an electrically scannable array of optical detectors. The array is selectively illuminated, i.e. irradiated, by at least two portions of a spectral band image of radiation. One of the portions is associated with a first spectral range and the other portion is associated with a second spectral range. The first and second ranges include mutually exclusive first and second spectral components, respectively, and a common third spectral component which is intermediate of the other two components. The detectors are calibrated by means which include a pair of optical filters. One of the filters is a single narow band transmission which has a transmission characteristic corresponding to one of the three aforementioned spectral components. The other filter is a double, i.e. two, narrow band transmission filter which has a transmission characteristic corresponding to the other two spectral components.