Abstract: Disclosed is a topcoat composition comprising a polymer having a dissolution rate of at least 1500 ?/second in an aqueous alkaline developer, and at least one solvent. The topcoat composition can be used to coat a photoresist layer on a material layer on a substrate, for example, a semiconductor chip. Also disclosed is a method of forming a pattern in the material layer of the coated substrate.
Type:
Grant
Filed:
April 28, 2006
Date of Patent:
April 21, 2009
Assignee:
International Business Machines Corporation
Inventors:
Robert Allen David, Phillip Joe Brock, Sean David Burns, Dario Leonardo Goldfarb, David Medeiros, Dirk Pfeiffer, Matt Pinnow, Ratnam Sooriyakumaran, Linda Karin Sundberg