Abstract: A market-demand-forecasting-value calculation section acquires order entry actual achievement data from an order-entry-actual-achievement-data storing unit of an order receiving system, and calculates a market demand forecasting value using the order entry actual achievement data. A correction safety inventory quantity calculation section calculates an error rate, which becomes negative when an ordering required-quantity becomes large, based on a number of ordered parts and a past ordering required-quantity. Subsequently, the correction safety inventory quantity calculation section calculates a correction safety inventory quantity using the error rate and the market demand forecasting value and a money-amount-zone index value.

Abstract: A surveillance camera system includes a surveillance camera having pan/tilt capability, a display for displaying images picked-up by the surveillance camera thereon, a pointing device for indicating the movement of the surveillance camera in a visual field direction, and a remote-controlled monitoring device including a control unit for displaying the images on the display and for displaying a pointer thereon indicating the coordinate position of the pointing device so as to overlap with the images, and when the pointer is moved from a first point to a second point on the images, the control unit transmits a predetermined control signal from the remote-controlled monitoring device to the surveillance camera, and by the control signal, the control unit moves the surveillance camera in the moving direction of the pointer at a speed proportional to the length between the first point and the second point.

Abstract: A thermal barrier coating material, containing a metal binding layer laminated on a base material and a ceramic layer laminated on the metal binding layer, the ceramic layer comprising partially stabilized ZrO2 which is partially stabilized by additives of Dy2O3 and Yb2O3.

Abstract: A thin film transistor array substrate including an insulating substrate, a first metallic pattern formed on the insulating substrate, and an insulating film provided on the first metallic pattern. A semiconductor pattern is provided on the insulating film, and a second metallic pattern is provided on the semiconductor pattern. The second metallic pattern is surrounded by the semiconductor pattern.