Abstract: A tight-tolerance, low-resistance, high-power chip resistor for mounting on a circuit board in parallel and adjacent relationship to such board. There are discrete terminal plates mounted on one surface of a substrate, in spaced-apart relationship to each other but still quite close to each other. Electrical connections are made by the customer to the terminal plates, at different regions thereof, without adversely affecting the tight-tolerance relationship. The terminal plates additionally provide heat spreading from the resistance film, enhancing the power handling capability of this low-resistance, high-power chip resistor.

Abstract: A slurry for chemical-mechanical polishing comprises a high pH solution with particles of a catalyst mixed with the high pH solution for accelerating the polishing rate. The catalyst preferably is a metal selected from the group consisting of platinum, silver, palladium, copper, rhodium, nickel, and iron. The catalyst may be impregnated into a polishing pad used to apply the slurry to a surface. A CMP process for metal surfaces includes applying a slurry to a metal surface to be polished, and providing an electrical bias to the workpiece and to the slurry for controlling the polishing rate. The electrical bias is provided to dies in the workpiece by means of an electrical connection between a bias voltage source and scribe lines between adjacent dies.