Abstract: The present invention provides a method and device for restoring individual patient joint kinematic using minimally invasive surgical procedures. The instrumentation of the invention sculpts the articular surface of a first bone that normally articulates in a predetermined manner with a second bone. The implant system is comprised of implants that provide intraoperative surgical options for articular constraint and facilitate proper alignment and orientation of the joint to restore kinematics as defined by the individual patient anatomy.

Abstract: An improved apparatus and method for creating high quality virtual reality panoramas is disclosed that yields dramatic improvements during the authoring and projecting cycles, with speeds up to several orders of magnitude faster than prior systems. In a preferred embodiment, a series of rectilinear images taken from a plurality of rows are pairwise registered with one another, and locally optimized using a pairwise objective function (local error function) that minimizes certain parameters in a projective transformation, using an improved iterative procedure. The local error function values for the pairwise registrations are then saved and used to construct a quadratic surface to approximate a global optimization function (global error function). The chain rule is used to avoid the direct evaluation of the global objective function, saving computation.

Abstract: A dermatological patch for removing keratotic plugs from pores of the skin to improve the health and appearance of skin. The patch comprises a pad having a lower surface having a polymeric adhesive composition, which does not require premoisturization of the patch by the user to effect its operation. The patch can be of different shapes, formed of transparent, clear or colored material so as to enhance its cosmetic appearance on the skin, and contain additives to enhance the use of the patch for improving skin health.

Abstract: A method for forming a metal/metal nitride layer. A dielectric layer is formed on a substrate comprising a conductive region. The dielectric layer comprises an opening exposing a portion of the conductive region. A conformal metal layer is formed on the dielectric layer by physical vapor deposition using a collimator to cover the exposed conductive region. A metal nitride layer is formed on the metal layer. A part of the metal layer may be exposed due to poor step coverage. An implanting process is performed on the metal nitride layer and on the exposed metal layer using a nitric gas.

Abstract: A composition and method for preparing a food supplement. The composition consisting essentially of at least 70% by weight of an oil seed constituent, at least 8% by weight of an additional plant constituent and at least 4% by weight of yeast wherein oil seed constituent, additional plant constituent and yeast are prepared by blending and cutting for less than about 20 minutes at a temperature of less than about 100.degree. F. and in the presence of light of a wavelength not greater than that of red light and of an intensity not greater than that of a darkroom light to thereby inhibit oxidation of the components of the composition.

Abstract: Edge detection or region definition technology in picture colorization masks objects of a frame by identifying pixels in the frame which fall within a determined range of luminance values. A seed point is selected within an object to be masked, and a test area is generated around the seed point. The test area may be any arbitrary shape or size. A range of luminance values of the pixels in the test area is generated, with the boundary values of the range representing the pixels having the highest and lowest luminance values. Pixels within the object to be masked which have luminance values falling within the range are identified and highlighted. The boundary values of the range may then be adjusted depending upon the satisfaction of the colorist. A mask is then defined to comprise the identified and highlighted pixels.

Abstract: An arrangement of bump pads for use on a face of a flip-chip semiconductor die. The arrangement comprises four corner regions, each corner region comprising multiple I/O bump pads and power bump pads. The corner regions are specialized bump arrangements depending upon the size of the die, signal to power ratios, and the core power requirements. The die arrangement also comprises multiple edge regions having multiple I/O bump pads and power bump pads. The edge regions are located along the edges of the die and are interleaved between the corner regions. The dimensions of the corner regions and the edge regions depend upon the power to signal ratio of the region. Also provided is a core power region having multiple power bump pads, centrally located within the edge regions and the corner groups. Core requirements mandating an odd number of rows and columns of bumps for the core require a special "checkerboard" arrangement also provided. Connections between the bumps and the edge of the die surface are shown.

Abstract: The mechanical lock has an elongated housing. A pair of end bushings mounts in the housing, and a rod translates through the end bushings and at least partially through the housing. A pair of coiled locking springs within the housing are around the rod and between the end bushings. One end of each locking spring is fixed within the housing, and the other end of each locking spring is free. The normal inside diameter of each locking spring is less than the outside diameter of the rod so that the locking springs secure the rod. A handle can uncoil the free end of each locking spring to increase their inside diameter and release the rod. A wedge bushing mounts in the housing between the locking springs. The face on each end bushing against its respective locking spring is at an angle, and the wedge bushing also has an angled face on the other side of each spring.