Abstract: A solar simulator for measuring the current-voltage characteristics of photovoltaic devices, in which an irradiated test plane of the object to be measured is disposed opposite an illuminating surface of the light source, the whole test plane of the photovoltaic devices is divided imaginarily into a plurality of sections, and a selected member for adjusting irradiance is disposed opposite the test plane of each imaginary sections so as to equalize or substantially to equalize the irradiance by the light source at every irradiated test plane of the sections, after which light from the light source is directed onto the test plane of the object to be measured.

Abstract: In order appropriately to prevent leakage of an authentication symbol string such as a credit card number, and for it to be possible for a user to be authenticated as a legitimate user: an ID issuance server 20 receives the first eight digits of the credit card number from a portable telephone device 10 of the user and issues a one-time ID to the portable telephone device 10; a service provision server 30 receives the last eight digits of the credit card number and the one-time ID from a PC 11, and transmits the one-time ID and those last eight digits to a number construction and authentication processing server 40; and the number construction and authentication processing server 40 receives the one-time ID and the last eight digits from the service provision server 30, communicates with the ID issuance server 20 and acquires the first eight digits which correspond to the one-time ID, reconstructs the credit card number, and performs authentication with the credit card number.

Abstract: A surgical saw for cutting bone that can be used with ease in tight places yet maintain sufficient cutting power. The surgical saw 10 has a flexible linear body made of twisted stainless steel wire and cutting parts formed on the flexible linear body. The cutting parts are made of abrasive material affixed to the flexible linear body 12a alternating with portions of the flexible linear body with no abrasive particles 12b. Auxiliary cutting parts 13 of lesser cutting power may be provided along both lateral sides of each of the cutting parts 12.

Abstract: Verification facilitating company or companies X and verifying company or companies (e.g., credit service company or companies) Y may respectively manage member ID(s) and password(s) of user(s) 1 in mutually separate and mutually secret fashion. User(s) 1 may send member ID(s) to verification facilitating company or companies X from mobile telephone(s) 2, and verification facilitating company or companies X may use originating telephone number(s) and/or member ID(s) to carry out first-stage identity check(s). In the event of positive verification of identity as a result of such identity check(s), verification facilitating company or companies X may issue one-time ID(s) to user(s) 1 and may communicate such one-time ID(s) to verifying company or companies (e.g., credit service company or companies) Y. User(s) 1 may send one-time ID(s) and password(s) to verifying company or companies (e.g., credit service company or companies) Y from company or companies (e.g., store or stores) Z.

Abstract: A method for manufacturing an eyeless needle by which a satisfactory hole can be formed in the end surface of a fine suture needle having a needle diameter less than 150 micrometers is proposed. In a method for manufacturing an eyeless needle by forming a hole for inserting and fixing one end of a suture thread by caulking in the end surface of the eyeless suture needle made of stainless steel, the hole is formed by irradiating the end surface of a needle material thicker by 6 to 20 micrometers than a desired needle diameter of the suture needle less than 150 micrometers with one shot of a laser beam, and subsequently, a portion thicker than the desired needle diameter is removed by electrolytic polishing or chemical polishing.

Abstract: An electron beam corresponding to radiation intensity data is output from an electron source by supplying high energy pulses p-1 through p-n, which correspond to the radiation intensity data of a radiation field, to the electron source from a power source 108. This electron beam is deflected so as to be incident in parallel to the medial axis of a plurality of X-ray target tubes 104-1 through 104-n by a deflection means comprising electromagnets, such that X-ray beams x-1 through x-n, which are produced when the electron beam collides with an inner wall of an X-ray target tube are irradiated with a desired intensity.

Abstract: A laminator 100 in which the diaphragm can be mounted simply and easily without the use of a mounting frame. The laminator 100 includes an upper chamber 110, on the bottom surface of which is mounted the diaphragm 140, and a lower chamber 120 on which the upper chamber 110 is stacked and in which is disposed a support base 130 on which a workpiece A that is to be laminated is set. The diaphragm 140 is larger than the upper chamber 110, and an excess portion of the diaphragm that protrudes outside the upper chamber when the diaphragm is mounted on the upper chamber is folded upward and clamped against the sides of the upper chamber by multiple clamps to fix the diaphragm in place on the upper chamber.

Abstract: A method of manufacturing a fuel cell bipolar plate that improves dimensional accuracy even with viscous material, eliminates the need for large-scale production equipment such as a press to make a pre-formed product, and furthermore, enables manufacturing time for the fuel cell bipolar plate to be reduced. Powdered raw material A containing electrically conductive material and resin is dropped into a filling container so that a top thereof is flat. The powdered raw material A inside the filling container is then heated to form a temporary cast B, the temporary cast B is set in a mold in which a predetermined pattern is formed, and heated and compressed to form a fuel cell bipolar plate.

Abstract: The surface of an epitaxial wafer is inspected using an optical scattering method. The intensities of light scattered with a narrow scattering angle and light scattered with a wide scattering angle reflected from laser light scatterers (LLS) on the wafer surface are detected. If the intensifies of narrowly and widely scattered lights are within a prescribed sizing range, it is judged whether the laser light scatterer is a particle or killer defect by deciding into which zone (410, 414, 418, 439) within the sizing range the PLS size based on the narrowly scattered light intensity and the PLS size based, on the widely scattered light intensity fall. If the intensity of the narrowly or widely scattered light exceeds the sizing range (417, 420, 421, 423, 424, 425), or if a plenty of laser light scatterers are continuous or concentrated (422), the laser light scatterers are judged to be killer defects.

Abstract: A semiconductor wafer surface inspection apparatus detects LADs (Large Area Defects) which are flat and have low heights and differentiates them from particles. This inspection apparatus irradiates each point on the surface of a semiconductor wafer 200 with two parallel laser beams perpendicularly to the points while scanning the surface, and by measuring the phase difference between the two reflected beams, detects points 400 at which an upward inclination exists and points 402 at which a downward inclination exists on the surface of the wafer 200. Areas 404 in which pairs or sets of upward-inclination points 400 and downward-inclination points 402 exist within a prescribed range of mutual distances are inferred to be LADs.