Patents Represented by Attorney Ottersedt, Ellenbogen & Kammer, LLP

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  • Wire bond integrated circuit package for high speed I/O
    Patent number: 7804167
    Abstract: An integrated circuit package includes a package substrate, a die attach pad formed on the package substrate for securing a die to the package substrate, a ground bonding ring formed on the package substrate for attaching core and I/O ground bond wires between the die and the package substrate, and a first plurality of bond fingers formed immediately adjacent to the ground bonding ring for attaching a first set of I/O signal bond wires between the package substrate and the die.
    Type: Grant
    Filed: December 1, 2006
    Date of Patent: September 28, 2010
    Assignee: LSI Logic Corporation
    Inventors: Clifford Fishley, Abiola Awujoola, Leonard Mora, Amar Amin, Maurice Othieno, Chok J. Chia