Abstract: The present invention generally relates to a digital scanner for scanning images. More specifically, the present invention is directed to a method and apparatus for enhancing the quality of scanned images obtained by filtering out the infrared component of digital data to provide enhanced digital images.

Abstract: The present invention generally relates to a digital scanner for scanning images. More specifically, the present invention is directed to a method and apparatus for accurately scanning documents and for processing digital data to provide digital images stored in memory, which can be retrieved for printing on support material or for displaying on a display screen.

Abstract: The present invention generally relates to a photosensor array including a plurality of photosites; an amplifier associated with each photosite and including a plurality of transistors, wherein the amplifier includes autozeroing transistors for autozeroing at low power to remove voltage offsets in the amplifier; a transfer circuit associated with each photosite for transferring a charge on the photosite to a reset node interposed between the photosite and amplifier.

Abstract: Geometric configurations for photosites found on photosensitive chips for creating electrical signals from an original image, as would be found, for example, in a digital scanner, copier, facsimile machine, or other document generating or reproducing device. The photosensitive chips are mounted on a substrate to form a photosensitive array in a full width scanner or other photosensitive device. The geometric configurations reduce the Moiré patterns to provide a higher quality image.

Abstract: Geometric configurations for photosites found on photosensitive chips for creating electrical signals from an original image, as would be found, for example, in a digital scanner, copier, printer, facsimile machine, or other document generating or reproducing device. The photosensitive chips are mounted on a substrate to form a photosensitive array in a full width scanner or other photosensitive device. The geometric configurations reduce the Moiré patterns to provide a higher quality image.

Abstract: The present invention generally relates to electrical detection of V-groove width during the fabrication of photosensitive chips, which create electrical signals from an original image, as would be found, for example, in a digital scanner or facsimile machine.

Abstract: The present invention relates to photosensitive chips for creating electrical signals from an original image, as would be found for example in a digital scanner, copier, facsimile machine, or other document generating or reproducing device. More specifically, the present invention relates to preferably providing a supplemental chip in each abutment region to enhance image quality.

Abstract: The present invention generally relates to a loopback direct memory access control system for a digital scanner for processing images. More specifically, the present invention is directed to a method and apparatus for quickly reading digital data from memory, processing the digital data and writing the processed digital data to memory.

Abstract: An apparatus detects the width of a V-groove formed on a semiconductor wafer. A resistor overlaps a chip area and an area upon which the V-groove is to be etched on the wafer. A pad etched on the silicon wafer is coupled to the resistor. A tester supplies voltage to the pad after the V-groove has been etched into the silicon wafer; and a circuit coupled to the pad determines the width of the etched V-groove.

Abstract: The present invention generally relates to electrical detection of V-groove width during the fabrication of photosensitive chips, which create electrical signals from an original image, as would be found, for example, in a digital scanner or facsimile machine.

Abstract: The present invention relates to electro optical devices with a reduced filter thinning on the edge pixels and a method for reducing the thinning of filter layers on the pixels closest to the edge of an electro optical device such as a photosensitive chip, as would be used, for example, in a full-color digital copier or scanner. A semiconductor wafer includes a main surface defining a plurality of chip areas and tab regions separated by grooves, wherein the chip areas include inner photosites, outer photosites and bonding pads. A plurality of dams are deposited over the main surface in the tab regions, and a clear layer is deposited over the main surface exclusive of the bonding pads. Alternatively, a clear layer is deposited over the main surface exclusive of the bonding pads, and a plurality of tabs is then deposited in the tab regions on the main surface.