Patents Represented by Attorney P. J. Thoma
  • Patent number: 3982308
    Abstract: A clamping apparatus for holding semiconductor devices in compression is described in which supporting plates are disposed at opposite ends of the apparatus and supporting shafts extend the length of the apparatus connecting the supporting plates. The supporting plates are fixed in place by protrusions in the walls of the supporting shafts. The compressive force is provided by a spring means held in compression by the supporting plates.
    Type: Grant
    Filed: August 27, 1975
    Date of Patent: September 28, 1976
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Yoshitada Yoneda