Patents Represented by Attorney Parsons Hshue & de Runtz LLP

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  • Process condition sensing wafer and data analysis system
    Patent number: 6889568
    Abstract: A measuring device incorporating a substrate with sensors that measure the processing conditions that a wafer may undergo during manufacturing. The substrate can be inserted into a processing chamber by a robot head and the measuring device can transmit the conditions in real time or store the conditions for subsequent analysis. Sensitive electronic components of the device can be distanced or isolated from the most deleterious processing conditions in order increase the accuracy, operating range, and reliability of the device.
    Type: Grant
    Filed: January 24, 2002
    Date of Patent: May 10, 2005
    Assignee: SensArray Corporation
    Inventor: Wayne G. Renken