Abstract: An apparatus configured to confine a plasma within a processing region in a plasma processing chamber. In one embodiment, the apparatus includes a ring that has a baffle having a plurality of slots and a plurality of fingers. Each slot is configured to have a width less than the thickness of a plasma sheath contained in the processing region.
Type:
Grant
Filed:
October 25, 2007
Date of Patent:
July 13, 2010
Assignee:
Applied Materials, Inc.
Inventors:
Kallol Bera, Yan Ye, James D. Carducci, Daniel J. Hoffman, Steven C. Shannon, Douglas A. Buchberger, Jr.