Abstract: The present invention is a coldplate hotspot spray cooling system that cools an electronic component creating a varying amount of heat across its surfaces. Liquid coolant is dispensed upon a spray pin protruding from a base wherein the liquid creates a very high heat absorbing evaporative thin film. The spray pin is located over an area of the chip that produces a large heat flux, typically referred to as a hotspot. The small size and isolation of the spray pin provides the ability to generate very large heat fluxes. Multiple spray pins are possible.

Abstract: The present invention is a compact pump that is powered by a brushless DC spindle-motor, as used in disk drives and CD-ROM drives. A hard drive type spindle-motor is a brushless DC motor that is highly balanced, very reliable, available at low cost, and is capable of significant rotational speeds. According to the present invention, a spindle-motor is mounted to a pump housing and to an impeller within the housing. The spindle-motor rotates the impeller causing movement of a fluid. Preferably for spray cooling, the pump is a turbine pump.

Abstract: The present invention is a liquid cooling system that cools a plurality of electronic components connected in parallel. A pump delivers a cooling fluid, as a liquid, to a supply manifold wherein it splits into distinct branch lines. Preferably, the branch lines feed coolant to individual spray modules. The liquid coolant removes heat from the components to be cooled. The resulting fluid mixture exits the spray modules via a plurality of return branches. Each individual return branch feeds into a return manifold at an acute angle. The angular transitions between the return branches and the return manifold provides low manifold losses and a more efficient system.

Abstract: The present invention is a two-phase liquid cooling system that cools a plurality of electronic components connected in parallel. A pump delivers a cooling fluid, as a liquid, to a supply manifold wherein it splits into distinct branch lines. Preferably, the branch lines feed coolant to individual spray modules. The liquid coolant removes heat from the components to be cooled. The resulting liquid and vapor mixture exit the spray modules via a plurality of return branches. Each individual return branch feeds into a return manifold at an acute angle. The angular transitions between the return branches and the return manifold provides low manifold losses and a more efficient system.

Abstract: The present invention is a spray cooling thermal management device that cools an electronic component. Liquid coolant is dispensed upon a heated surface containing etched open microchannels.

Abstract: A low liquid retention fuel nozzle that is mainly comprised of a nozzle body and a spout attached to the nozzle body. A fuel supply travels down the nozzle body and through the spout and into a container. Typically, after the flow of fuel is stopped within a nozzle, fuel drips from the spout and resides on its surfaces. Nozzle spouts are typically made from aluminum which is easily wet-out by fuels which facilitates the creation of drips and residual fuel. The present invention is directed towards a spout with one or more surfaces that have a low surface energy. The low surface energy promotes drops to form. The resulting drops are likely to fall into the container to be filled prior to the user removing the spout from the container. The result is less contaminating fuel drops on the ground and less environmentally polluting fuel vapors reaching the atmosphere.