Patents Represented by Attorney Paul J. 10 Winters

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  • Support assembly for integrated circuits
    Patent number: 4800419
    Abstract: A composite support assembly for an integrated circuit chip includes a rigid lead frame that is attached to a relatively thin flexible tape-like structure. The tape-like structure is etched with inner lead fingers and outer lead fingers to allow a short pitch, high density arrangement of the lead fingers, thereby enabling bond wires that connect an IC chip to the support assembly to be shortened. As a result, a significant increase in the number of leads is realized, using a standard size IC package.
    Type: Grant
    Filed: January 28, 1987
    Date of Patent: January 24, 1989
    Assignee: LSI Logic Corporation
    Inventors: Jon Long, V. K. Sahakian