Abstract: An aqueous coating agent for forming lubricating films comprising a hydrophilic resin; a solid lubricating agent comprising MoS2 and at least one antimony sulfide selected from the group consisting of Sb2S3 and Sb2S5, where a weight ratio of MoS2 to antimony sulfides is from 1;0.05 to 1:12; and water and wherein the weight ratio of the solid lubricating agent to the hydrophilic resin is from 0.7:1 to 3:1.

Abstract: Silicone rubber composition comprising an alkenyl-substituted diorganopolysiloxane, an inorganic filler, an organopolysiloxane that contains at least two silicon-bonded hydrogen atoms in each molecule, in a quantity that affords a value from 0.4 to 10 for the molar ratio of silicon-bonded hydrogen in the organopolysiloxane to alkenyl groups in the alkenyl-substituted diorganopolysiloxane, an organohydrogenpolysiloxane, in a quantity that affords a value from 0.01 to 0.5 for the molar ratio of silicon-bonded hydrogen in this component to alkenyl groups in the alkenyl-substituted diorganopolysiloxane, and a platinum catalyst. A fluororesin-covered fixing roll in which a fluororesin layer is placed over the circumference of a roll shaft with a silicone rubber layer interposed between the fluororesin layer and the roll shaft, wherein said silicone rubber composition is formed by curing the silicone rubber composition described above.

Abstract: A thermally conductive silicone rubber composition comprised of (A) 100 parts by weight of an organopolysiloxane that contains at least two silicon-bonded alkenyl groups per molecule, (B) 0.1 to 50 parts by weight of an organohydrogenpolysiloxane that contains at least two silicon-bonded hydrogen atoms molecule, (C) 0.1 to 10 parts by weight of organosiloxane that contains at least one silicon-bonded alkoxy group per silicon-bonded hydroxyl per molecule, (D) 300 to 1200 parts by weight of fine alumina powder comprised of (i) 5 to 95 wt % of spherical or nonspherical fine powder of an average particle diameter of up to 10 .mu.m and of (ii) 95 to 5 wt % of spherical or nonspherical fine alumina powder of an average particle diameter of 10 to 50 .mu.m, and (E) a catalytic quantity a hydrosilylation reaction catalyst.

Abstract: Foamable organosiloxane compositions which yield, upon cure, silicone foams having low density and decreased friability, comprising a siloxane base polymer having an average of at least two hydroxyl groups per molecule, a silicon-containing crosslinker for the siloxane base polymer, wherein the crosslinker contains at least two --SiH groups per molecule; a platinum group catalyst; a silicone resin copolymer; and optionally, a blowing agent; and silicone foams prepared therefrom. A method of weather-stripping a door or window using a silicone foam so prepared.

Abstract: A silicone die attach adhesive comprising a silicone composition that cures both through the free radical reaction of acrylic-functional organopolysiloxane as induced by exposure to high-energy radiation and through the hydrosilylation reaction between alkenyl-functional organopolysiloxane and silicon-bonded hydrogen-functional organopolysiloxane.Also, a fabrication method characterized bymounting a semiconductor chip on a substrate or in a package with the aforesaid silicone die attach adhesive sandwiched between the semiconductor chip and substrate or package,then inducing the free radical reaction of the acrylic functional groups by exposing the die attach adhesive to high-energy radiation, and thereaftercuring the die attach adhesive by the hydrosilylation reaction.A semiconductor device characterized in that it has been fabricated by the above-described method.

Abstract: A silicone composition curable to a silicone bonding agent that is suitable for use in manufacturing an optical memory element comprises:(A) 100 parts by weight of an organopolysiloxane having an average of at least two silicon-bonded alkoxy groups per molecule and an average of at least two silicon-bonded alkenyl groups per molecule, wherein the alkoxy groups and the alkenyl groups are in the same molecule;(B) an organohydrogenpolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule, wherein the molar ratio of silicon-bonded hydrogen atoms in component (B) to silicon-bonded alkenyl groups in component (A) is from 0.3:1 to 20:1;(C) 0.01 to 20 parts by weight of a metal condensation reaction catalyst wherein the metal of said metal condensation reaction catalyst is selected from the group consisting of titanium, zirconium and aluminum; and(D) a catalytic amount of a hydrosilylation reaction catalyst. The composition is cured by an addition reaction and a condensation reaction.

Abstract: A composite molding comprising a silicone gel molding and a peelable film which does not suffer from the problems of adhesion of dirt and dust, adhesion of moldings to each other or deformation of moldings, and which has improved handling characteristics. The invention also covers a method for manufacturing such a composite molding.

Abstract: Organosiloxane compositions exhibiting excellent vibration damping properties comprise(A) from 70 to 99.9 weight percent of a liquid polyorganosiloxane,(B) from 0.1 to 10 weight percent of hollow particles of a thermoplastic organic resin, and(C) from 0 to 20 weight percent of a thickener.

Abstract: Disclosed is a heating element having improved performance, particularly at high power densities and high temperatures. The heating element comprises a substrate having a first layer comprising a silicon based electrically insulating material on its surface. On a surface of the first layer is a second layer comprising a silicon based electrically resistive material. Attached to the second layer are at least two separate areas of silicon based electrically conductive material. Each of these separate areas are suitable for connection to a power supply.

Abstract: A curable organosiloxane composition useable as a silicone die attach adhesive, an electrically conductive silicone rubber composition each comprising a composition that cures through both addition and condensation reactions, that will not impair wire bondability to a semiconductor chip or lead frame after the semiconductor chip has been bonded to a substrate or package; and semiconductor devices in which the semiconductor chip is bonded to its substrate or package using the curable organosiloxane composition and in which the semiconductor device that evidences high reliability by virtue of the use of the curable organosiloxane composition.

Abstract: A low durometer fixing roll comprising a roller shaft, a peelable organic resin layer established on the external circumferential surface of the roller shaft, and a silicone gel layer interposed between them. A silicone gel composition for use in a fixing roll, said gel composition comprising (A) an alkenyl-substituted organopolysiloxane, (B) an organohydrogenpolysiloxane, in a quantity sufficient to provide 0.1 to 5 moles of silicon-bonded hydrogen in component (B) per mole of alkenyl groups in component (A) and (C) a sufficient quantity of platinum catalyst for curing the silicone gel composition.

Abstract: A foamable, curable organosiloxane composition comprising an alkenyl-functional polyorganosiloxane, an organohydrogensiloxane, a blowing agent, a platinum catalyst and an adhesion promoter comprising an epoxy-functional compound, a hydroxyl-functional compound, a tetraalkylorthosilicate, an organotitanate and an aluminum or zirconium compound.

Abstract: Foamable organosiloxane compositions which yield, upon cure, silicone foams having low density and decreased friability, comprising a siloxane base polymer having an average of at least two hydroxyl groups per molecule; a silicon-containing crosslinker for the siloxane base polymer, wherein the crosslinker contains at least two --SiH groups per molecule; a platinum group catalyst; a silicone resin copolymer; and optionally, a blowing agent; and silicone foams prepared therefrom. A method of weather-stripping a door or window using a silicone foam so prepared.

Abstract: A method for the preparation of very pure organopentasiloxane having the hydrogen atom or an aliphatically unsaturated monovalent hydrocarbon group bonded to the silicon atom at one molecular chain terminal and having a hydrolyzable group or groups bonded to the silicon atom at the other molecular chain terminal.

Abstract: A foamable, curable organosiloxane composition comprising an alkenyl-functional polyorganosiloxane, an organohydrogensiloxane, a blowing agent, a platinum catalyst and an adhesion promoter comprising an epoxy-functional compound, a hydroxyl-functional compound, a tetraalkylorthosilicate, an organotitanate and an aluminum or zirconium compound.

Abstract: A silicone rubber composition which can be used to provide a formed-in-place gasket which exhibits excellent pressure resistance immediately after its site application and cures into a highly pressure-resistant and strongly adherent silicone rubber gasket comprising (A) 100 weight parts of a mixture of comprising an alkoxy-substituted polyorganosiloxane and an alkenyl-substituted polyorganosiloxane; (B) a hydrogen-containing polyorganosiloxane an alkoxysilane; a condensation reaction catalyst; and platinum catalyst.

Abstract: Oligomers wherein phenylalkylsiloxane units comprise at least a portion of the repeating units increase the ability to penetrate porous substrates that is exhibited by crosslinkable liquid organosiloxane compositions containing polyorganosiloxanes when the oligomer exhibits limited compatibility with the crosslinkable polyorganosiloxane(s) present in the curable organosiloxane composition.

Abstract: Iodine terminated liquid telechelic telomers of chlorotrifluoroethylene (CTFE) containing an average of more than 1 CTFE unit per molecule are novel compounds. The telomers can be prepared by a photochemically initiated reaction between liquified CTFE and either elemental iodine or the telogen ICF.sub.2 CFClI at temperatures below about 50.degree. C.