Patents Represented by Attorney Pepper Hamiltton LLP
  • Patent number: 7498826
    Abstract: A probe array wafer includes a substrate upon which a plurality of compliant probes are mounted. Pairs of axially aligned probes may be electrically connected together to provide a pass through power connection from the test equipment to the device under test. Likewise, pairs of axially aligned probes may be electrically connected together to provide a ground connection from the test equipment to the device under test.
    Type: Grant
    Filed: August 25, 2006
    Date of Patent: March 3, 2009
    Assignee: Interconnect Devices, Inc.
    Inventors: Eric L. Bogatin, David W. Henry, Donald A. Marx