Abstract: A probe array wafer includes a substrate upon which a plurality of compliant probes are mounted. Pairs of axially aligned probes may be electrically connected together to provide a pass through power connection from the test equipment to the device under test. Likewise, pairs of axially aligned probes may be electrically connected together to provide a ground connection from the test equipment to the device under test.
Type:
Grant
Filed:
August 25, 2006
Date of Patent:
March 3, 2009
Assignee:
Interconnect Devices, Inc.
Inventors:
Eric L. Bogatin, David W. Henry, Donald A. Marx