Abstract: Methods and apparatuses for analyzing and controlling performance parameters in planarization of microelectronic substrates. In one embodiment, a planarizing machine for mechanical or chemical-mechanical planarization includes a table, a planarizing pad on the table, a carrier assembly, and an array of force sensors embedded in at least one of the planarizing pad, a sub-pad under the planarizing pad, or the table. The force sensor array can include shear and/or normal force sensors, and can be configured in a grid pattern, concentric pattern, radial pattern, or a combination thereof.

Abstract: Computer housings with retractable expansion bay covers and methods for operating expansion bay covers. In one embodiment, a computer housing includes casing, a front bezel attached to the casing, and a retractable cover system attached to the casing and/or the front bezel. In one embodiment, the casing can have a side structure with a first side and a second side, and a front structure spanning across a front portion of the side structure. The front structure generally has a plurality of permanent drive bays and at least one expansion bay, and the front bezel generally has an opening for each permanent drive bay and an aperture for the expansion bays. The retractable cover system is slidably attached to the casing and/or the front bezel to selectively cover the expansion bay aperture. The cover system can include an internal track in the front bezel or along the side structure and a movable cover having a nub received in the track.

Abstract: An endpoint detector and performance monitoring system for quickly and accurately measuring the change in thickness of a wafer and other planarizing parameters in chemical-mechanical polishing processes. In one embodiment, an endpoint detector has a reference platform, a measuring face, and a distance measuring device. The reference platform is positioned proximate to the wafer carrier, and the reference platform and measuring device are positioned apart from one another by a known, constant distance. The measuring face is fixedly positioned with respect to the wafer carrier at a location that allows the measuring device to engage the measuring face when the wafer is positioned on the reference platform. Each time the measuring device engages the measuring surface, it measures the displacement of the measuring face with respect to the measuring device. The displacement of the measuring face is proportional to the change in thickness of the wafer between measurements.

Abstract: An apparatus for coupling at least two structures. The apparatus comprises a resilient, elongated coupling member having a plurality of spaced-apart apertures and a plurality of projections positioned between respective pairs of adjacent apertures. The apertures in a first portion of the coupling member are sized and positioned to removably receive the projections of a second portion of the coupling member when the coupling member is wrapped around a bundle or structure.