Abstract: A hamburger fixing apparatus has a food material feeding line conveyor. Various kinds of sandwiches or hamburgers, as indicated on an order display board, are prepared by an automatic feeding mechanism controlled by a computer and an operator in a manner such that each of the food materials necessary for the ordered items is added one on another while being conveyed on the food material feeding line conveyor. The food material feeding line conveyor has a first automatic fixing section in its upstream starting end region, a second automatic fixing section in its downstream finishing end region and a manual fixing section between the two regions. The apparatus further has a stopping mechanism to accumulate an intermediate ordered item.

Abstract: Polymer particles having a small particle diameter and a narrow particle diameter distribution are obtained by a continuous polymerization method which does not accompany an increase of cohering products attaching to an inner face of a reaction vessel and an air-bubble invasion and, in which stirring of a material solution for polymerization is easy. An emulsion polymerization reaction or a suspension polymerization reaction is carried out by supplying a material solution for polymerization continuously to a clearance between coaxial double cylinders, which have stretched toward a direction crossing a horizontal plane, from the end side of the cylinders, by rotating at least one of the double cylinders round the axis and thereby, causing Taylor vortices. The polymer particles thus-formed are obtained by through the other end side of the double cylinders to the outside.

Abstract: A chip-type ceramic element contains a terminal electrode at each end and an inorganic insulating layer on the surface of the ceramic element between the electrodes. The terminal electrodes include a baked electrode formed from a conductive paste reacted with the material of the inorganic insulating layer. Layers of nickel and tin are plated on the baked electrode for improved heat resistance and soldering adhesion, respectively. The insulating layer prevents unwanted portions of the terminal electrodes from coming into contact with the ceramic element, thereby preventing dispersion in the resistance values of the element.

Abstract: The present invention provides nonvolatile semiconductor memory which has advantages permitting the cell of the memory circuit to integrate, the memory circuit to be easy to manufacture, and the manufacturing expense to be cut down. The nonvolatile memory (21) comprises a P type well for which a N+ type source (4) and a N+ type drain (3) is provided. A surface of a space between the source (4) and the drain (3) comprises a first portion (10a) and a second portion (10b). An insulating layer (6) for holding electrons spans the surface of the space. A memory gate electrode (5) is on the insulating layer (6) and spans the first portion (10a). The surface of the second portion (10b) and a part of the surface of the memory gate electrode (5) is covered with a first region electrode (24) attaching to the source (4). But the first region electrode (24) is insulated from the memory gate electrode (5) with the insulating layer (8).