Abstract: A method for high velocity coating optical fibers includes passing a fiber with diameter l at velocity V through a coating container to which liquid coating material with viscosity .mu. is supplied under pressure p. Unwanted bubble formation in the coating is prevented by adjusting one or more of the parameters V, l, .mu., and p using the relationship:S=pl/.mu.Vwhere S is a constant characteristic of the coating container/die structure.
Type:
Grant
Filed:
February 8, 1999
Date of Patent:
October 17, 2000
Assignee:
Lucent Technologies Inc.
Inventors:
Valerie Jeanne Kuck, Peter Gerald Simpkins
Abstract: The specification describes techniques for attaching double sided circuit boards having plated through holes to interconnection substrates using solder bump arrays. The through holes are filled with a high melting point solder which allows solder bumps to be located directly on the through hole thus saving board area and reducing the interconnection length.