Abstract: A vertical insulated gate transistor is manufactured by providing a trench (26) extending through a source layer (8) and a channel layer (6) towards a drain layer (2). A spacer etch is used to form gate portions (20) along the trench side walls, a dielectric material (30) is filled into the trench between the sidewalls gate portions (20), and a gate electrical connection layer (30) is formed at the top of the trench electrically connecting the gate portions (20) across the trench.
Type:
Grant
Filed:
December 8, 2003
Date of Patent:
August 28, 2007
Assignee:
NXP B.V.
Inventors:
Jurriaan Schmitz, Raymond J. E. Hueting, Erwin A. Hijzen, Andreas H. Montree, Michael A. A. In't Zandt, Gerrit E. J. Koops