Abstract: A low cost Surface Mount Carrier (SMC) for carrying integrated circuit chips mounted thereon. The carrier, or interposer, is a thin-small single layer or, a multi-layer deck of printed circuit board (FR-4) material with at least one direct chip attach (DCA) site for mounting a semiconductor chip. The DCA site has chip bonding pads wherein the integrated circuit chip's pads are wire bonded to or soldered to the carrier. The bonding pads are connected to wiring pads through interlevel vias and wiring lands or traces which may be on one of several wiring planes. The carrier is connected to the next level of packaging through the wiring pads.