Abstract: General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and semiconductor layers. Semiconductor devices are formed in a semiconductor layer of the membrane. The semiconductor membrane layer is initially formed from a substrate of standard thickness, and all but a thin surface layer of the substrate is then etched or polished away. In another version, the flexible membrane is used as a support and electrical interconnect for conventional die bonded thereto. Multiple die can be connected to the membrane, which is then packaged as a multi-chip module. Other applications are based on membrane processing for bipolar and MOSFET transistor fabrication, low impedance conductor interconnecting fabrication, flat panel displays, maskless (direct write) lithography, and 3D IC fabrication.

Abstract: According to a method of producing a key top for a pushbutton switch of the present invention, a base layer made of an insulating resin that can be plated with metal, an electroless plating layer to be formed on the surface of the base layer, and a polymer coating layer, if required, are stacked on the surface of a key top body. Alternatively, an electroplating layer formed by electroplating is further formed on the electroless plating layer. Therefore, a plating layer can be directly and easily formed on the insulating resin, whereby a key top for a pushbutton switch having a sensation of metal and being rich in design is obtained.

Abstract: General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and semiconductor layers. Semiconductor devices are formed in a semiconductor layer of the membrane. The semiconductor membrane layer is initially formed from a substrate of standard thickness, and all but a thin surface layer of the substrate is then etched or polished away. In another version, the flexible membrane is used as support and electrical interconnect for conventional integrated circuit die bonded thereto, with the interconnect formed in multiple layers in the membrane. Multiple die can be connected to one such membrane, which is then packaged as a multi-chip module. Other applications are based on (circuit) membrane processing for bipolar and MOSFET transistor fabrication, low impedance conductor interconnecting fabrication, flat panel displays, maskless (direct write) lithography, and 3D IC fabrication.

Abstract: A Three-Dimensional Structure (3DS) Memory allows for physical separation of the memory circuits and the control logic circuit onto different layers such that each layer may be separately optimized. One control logic circuit suffices for several memory circuits, reducing cost. Fabrication of 3DS memory involves thinning of the memory circuit to less than 50 &mgr;m in thickness and bonding the circuit to a circuit stack while still in wafer substrate form. Fine-grain high density inter-layer vertical bus connections are used. The 3DS memory manufacturing method enables several performance and physical size efficiencies, and is implemented with established semiconductor processing techniques.

Abstract: A winder for winding wire onto coil supports of dynamo-electric cores with translational, rotational, and stratification motions with respect to a central longitudinal axis of the dynamo-electric core is provided. The rotational motion may preferably be provided by the rocking motion of a gear sector. The stratification motion may preferably be provided by the implementation of a spiral groove. The spiral groove preferably shares the same longitudinal axis as the winder. The rotation of the spiral groove preferably creates a relative motion between the groove and the needles, thereby producing the radial stratification motion of the needles. Additionally, the winder includes a motor arrangement which is programmable and controllable. The motor arrangement may also provide a dampening effect to limit unwanted stratification motion.

Abstract: A Three-Dimensional Structure (3DS) Memory allows for physical separation of the memory circuits and the control logic circuit onto different layers such that each layer may be separately optimized. One control logic circuit suffices for several memory circuits, reducing cost. Fabrication of 3DS memory involves thinning of the memory circuit to less than 50 &mgr;m in thickness and bonding the circuit to a circuit stack while still in wafer substrate form. Fine-grain high density interlayer vertical bus connections are used. The 3DS memory manufacturing method enables several performance and physical size efficiencies, and is implemented with established semiconductor processing techniques.

Abstract: Interactive wagering systems and methods with multiple television feeds are provided. A plurality of television feeds may be related to a race and race-related characteristics. A television feed may carry television feed information, which may provide sufficient information to allow a user to select an appropriate television feed for a wager or to allow the system to automatically select an appropriate feed for a wager. The interactive wagering application may also record a television feed so that the user may interact with the television feeds at any time. Wagering services may be also provided to a user through more than one wagering interface.

Abstract: Emitters for locating an item or person who as in some way become separated from their expected location are provided. The emitters of the present invention comprise a power source, a light emitting means, and a radiowave emitting means, the light emitting means comprising a first and second electrode, a dielectric material and an electroluminescent material being provided between the first and second electrodes, the radiowave emitting means comprising an antenna. The antenna may comprise the first and/or second electrode. The emitter may be a separate unit or may be part of or attached to an item such as a survival suit, a waterproof suit, a wet suit, a dry suit, a diving suit, a coat, a waterproof coat, a harness, a buoyancy item or aid, a life jacket, a life raft, a lifeboat, a floatation aid, a life belt, etc.