Abstract: A venturi nozzle for air guns includes an elongated, cylindrically shaped tube having a restricted orifice in a compressed air receiving end thereof through which compressed air is passed into a discharge end thereof. The air flow area of the discharge end of the tube is greater than the air flow area of the orifice to allow expansion of the air exiting the orifice in a region of the discharge end of the tube adjacent the orifice. Apertures formed through the tube in the discharge end thereof adjacent the orifice permit ambient air to be drawn by venturi effect into the tube and to be discharged with the expanded air out of the discharge end of the tube.

Abstract: A heat transfer liquid having a boiling point at atmospheric pressure at least equal to the temperature at which a soldering, fusing or brazing operation is to be performed, is floated on a pool of a liquifiable metal having a density greater than, a melting point below, and a heat of vaporization above, that of the liquid. The metal is heated to a temperature between its melting and boiling points, and at least to the boiling point of the liquid, to continuously boil the liquid to establish a body of hot, saturated vapor having a density greater than that of air at atmospheric pressure. An article on which the soldering, fusing or brazing operation is to be performed is extended into the body of vapor to condense the vapor thereon. The latent heat of vaporization of the condensing vapor heats the article to the temperature for the operation, and the article is then withdrawn from the vapor for cooling.

Abstract: A sheet of magnetic material is placed over a surface of a malleable carrier and stuck with a multi-projectioned punch. Each projection of the punch removes a wafer of the magnetic material from the sheet of magnetic material, and embeds the wafer into the carrier to form a pattern of magnetic material wafers in the surface of the carrier. The carrier is then positioned, wafer bearing side down, over an adhesive coated surface of a substrate, and a surface of the carrier, opposite from the wafer bearing surface, is struck with a multiprojectioned punch to force with each projection an individual one of the wafers out of the surface of the carrier and into the adhesive on the substrate. The malleable carrier is then peeled from the adhesive coated surface of the substrate and from the wafers secured thereto, to leave on the surface of the substrate the pattern of magnetic material wafers.