Abstract: Upon user selection of a particular trick mode, the number of pictures that are displayed can be accordingly adjusted to correspond with the selected trick mode speed based on a determined display time. Subsequently, the bandwidth usage can be can be determined to ensure that the channel capacity between a playback device (100) and a remote decoder (136) has not been exceeded. For forward trick modes, in a case where the bandwidth between the playback device (100) and the remote decoder (136) would be exceeded, B-pictures can be uniformly eliminated throughout the playback segment. Where B-pictures were present and they have been eliminated, they can be replaced by dummy B-pictures. Again, if there is still insufficient bandwidth available between the playback device (100) and remote decoder (136), then P-pictures can be eliminated from the playback segment and uniformly replaced by dummy P-pictures.

Abstract: A semiconductor chip (10) has a plurality of metallized members (12) that are each advantageously bumped with a volume of gallium amalgam (18) to render the members wettable by a conventional solder.

Abstract: A moisture-collecting hood assembly (10) for a vapor-generating machine (12) includes a hood (14) having an open bottom (15)and upwardly tapering sides (16) and ends (18). On the inside of the hood is a gutter (24) for collecting moisture in the vapor condensing on the hood interior. Vapors from the machine that enter the hood are exhausted through a horizontally-oriented, moisture-collecting sleeve that has a central portion (46) whose cross-sectional area is larger than that of an inlet (43) in communication with the hood, and an outlet (48) in communication with a negatively pressurized exhaust line (49). The central portion of the sleeve serves to collect moisture in its lower portion that condenses from the vapor exhausted from the hood.

Abstract: Testing of a sequential circuit (10) containing at least one embedded RAM (16) is accomplished by first generating a set of sequential vectors and then applying the vectors in sequence to a set of primary circuit inputs (PO.sub.o -PO.sub.j). The vectors are generated such that upon application to the circuit, the vectors excite potential faults at nodes (A) upstream of the RAM and propagate the effects of the faults through the RAM to the primary circuit outputs (PO.sub.o -PO.sub.j). Also, the test vectors serve to excite faults downstream of the RAM by propagating values through the RAM needed to excite the downstream faults. The fault effects (if any) that propagate to the circuit primary outputs are compared to a set of reference values to determine if any faults are present.

Abstract: An electronic game (10) is provided with at least one, and preferably a plurality, of intelligent game pieces (14,14' ) which each contain a re-programamble memory device (30,70). The memory device (30,70) in each of the game pieces (14 and 14', respectively), stores characteristics of an activity to be simulated by the game (10). By re-programming the game pieces (14,14'), the characteristics of the activity simulated by the game (10) can be changed to make the activity more interesting and challenging.

Abstract: Inspection of a metallized pattern (14) on a substrate (12) to monitor both the lateral dimensions and the intensity variation beyond tolerance limits is carried out by first capturing the image of the pattern with a television camera (20). The captured image is then compared to each of two models (40 and 42) comprising comparison patterns whose features have their lateral dimensions eroded and dilated, respectively, and the other aspect dilated and eroded, respectively, by a factor corresponding to the dimensional and intensity tolerances. The results of such comparison are logically combined to yield an image containing only defects (if any).

Abstract: A scheme is provided for efficient transfer of N separate L-bit segments of data (where N and L are integers) to or from an L-bit register (14) in a device under test (10) serially coupled with at least one other register in a device (10') in a scan chain. To carry out such data transfer, a stream of N L-bit segments of interest is first concatenated to, and ahead of, a packet of L.sub.1 filler bits, where L.sub.1 is the cumulative number of register cells in the chain of devices (10') upstream of the L-bit register (14) in the device under test (10). The stream of L.sub.1 +NL bits is applied to the chain by shifting the first L.sub.1 bits of the block of NL bits through the chain to flush the previous data stored in the registers upstream of the L-bit register in the device under test (10). The remaining bits in the stream of L.sub.1 +NL bits are then shifted through the chain of devices (10 and 10' ) until the L.sub.

Abstract: Alignment of each of a plurality of depending first conductive members (16), in an array of orthogonal rows and columns on an article (12), with a corresponding second conductive member (18) arranged in a like array on a substrate (14), is accomplished by positioning the article in spaced relationship from the substrate. The arrays of first and second conductive members (16,18) are first angularly aligned by rotating the article (12) so that the offset between a first column of first and second conductive members on the article and substrate, respectively, as seen by a television camera (32) at a first end of the article and substrate is the same as the offset between a second column of first and second members on the article and substrate, respectively, at the other end thereof as seen by a second camera (30).

Abstract: An apparatus (40) for attaching successive pairs of wires (25) to successive pairs of opposed contacts (20) includes a pair of opposed ram assemblies (54), each provided with a knife blade (56) for ramming a wire against the contact for attachment thereto. Advantageously, the knife blade (56) is provided with a contact protector assembly (64) which serves to straddle the contact during wire attachment to protect the contact against deformation. The attachment apparatus (40) is also provided with a mechanism (88) for attaching each of a pair of strain reliefs (26,28) to the connector following attachment of the wires to the contacts to avoid the need to handle the connector between these two operations and to prevent any stress to the connection between the wire and contact.

Abstract: An apparatus (10) for spraying a liquid, such as a low-solids flux, onto a substrate (12), during its transit along a first path (15), comprises a spray gun (38) directed at the substrate. The gun (38) is carried by a carriage (34) reciprocated by a traversing mechanism (42,44,46) which reciprocates the gun back and forth along a second path (30) generally perpendicular to the first path (15). The spray gun (38) is reciprocated such that its spray pattern during each pass slightly overlaps the pattern made during the previous pass, thereby achieving substantially uniform liquid coating on the substrate. Each time the gun (38) reaches an end of its travel, its tip (39) is advantageously cleaned automatically by a brush (84) wetted by a solvent to avoid tip clogging.

Abstract: A three-dimensional image of the features on a surface (21) of a substrate (22) is obtained by first spanning the surface with a pair of lines of light (42 and 44), each directed from opposite sides to illuminate each of successive pairs of spaced-apart stripes (46,48) of surface area. The intensity of the light reflected from each successive strip (27) contiguous to, and lying between, the strips illuminated by the first lines of light is sensed. The surface (21) is next spanned with a second pair of lines of light (58,60) directed from opposite sides. The intensity of light reflected from each successive strip contiguous to, and lying between, the successive strips illuminated by the second pair of lines of light is sensed. A three-dimensional image of the substrate surface can be obtained from a prescribed relationship between the two sensed intensities.

Abstract: A set of test vectors for input to a circuit (10) to test the integrity of each of its n interconnections (nets) 16 is generated by first ordering the nets. Thereafter, the vectors are generated by assigning the bits of each vector associated with a given net a one or zero such that the vector has a minimum weight, as compared to the vectors assigned to successive nets. Alternatively, the test vectors can be generated by assigning the bits of selected groups of vectors a one or zero such that the groups of vectors each have minimum potential weight and the vectors in the group are independent of each other. The successive groups of vectors are then concatenated to yield the test vector set.

Abstract: An apparatus (18) for separating an individual chip (14) from a semiconductor wafer (10) adhered to a diaphragm (16) comprises a "C"-shaped arm (26) having parallel, spaced-apart upper and lower arm portions (28) and (29). The upper arm portion (28) is provided with a yoke (34) at its free end for engaging a robot (42) which carries a pickup tool (46). The free end of the lower arm portion (29) mounts a die ejector (38) lying directly beneath the pickup tool (46) when the robot (42) engages the upper arm portion (28). Once the die ejector (38) is positioned below, and the pickup tool (46) is positioned above, a particular chip (14), actuation of the die ejector causes the chip to be separated and urged upwardly for engagement by the pickup tool. In this way, the need to separately position the die ejector (38) and the pickup tool (46) is obviated.

Abstract: A baseband processing unit (10) for use in a cellular telephone cell site includes a digital signal processor (20) which serves to process forward voice signals intended for transmission to a mobile unit (12) as well as process the reverse voice signals received from the mobile unit. The digital signal processor further serves to produce a first supervisory audio tone (SAT) for transmission to the mobile unit by generating successive digital SAT samples which are decoded into a continuous tone. In addition, the digital signal processor serves to detect the presence of a second SAT generated by the mobile unit by sampling and processing successive samples of the second SAT and measuring the power thereof.

Abstract: Attachment of each of a pair of wires (12) in a cable (14) to each of a pair of opposed contacts (16) in a connector (20) is carried out by a connector attachment tool (10) which includes a cable clamp assembly (34) for clamping the cable in either a horizontal or vertical orientation. The clamp assembly holds the cable so that an operator can pull each of a pair of the wires along a separate one of a pair of wire guides (96,98) which each include retention springs (106,108,110) for grabbing the pulled wire. Each wire guide serves to align the wire pulled therealong with a separate one of a pair of opposed ram assemblies (86,88) located on opposite sides of a carriage (30) which carries the connector. Each ram assembly serves to force the wire aligned therewith into one of the opposed connector contacts aligned with the ram assembly.

Abstract: A network is disclosed for distributing a signal from a single source (18) to each of 2.sup.n (20.sub.1, 20.sub.2 . . . 20.sub.2n where n is an integer, such that the signals supplied to the loads each have substantially the same phase and amplitude. The network comprises 2.sup.n paths (22.sub.1, 22.sub.2 . . . 22.sub.2n), each coupling the source to a separate one of the loads. Each path is comprised of 2n+1 serially coupled segments 24.sub.1, 24.sub.4 . . . 24.sub.2n+1) with 2n-1 of the segments (24.sub.1, 24.sub.4 . . . 24.sub.2n-1) of each branch being common to another path. The segments in each path have corresponding impedances (Z.sub.1, Z.sub.2 . . . Z.sub.2n+1), respectively, which are selected so that each load is substantially matched to the source and that the internal reflection of the signals within each path is minimized.

Abstract: Automated insertion of pins (14) into apertures (12) in a backplane (10) is achieved by first shearing a predetermined number of pins from a continuous strip of pins (26). The sheared pins (12) are then engaged in a pin holder (134) which is indexed to locate the pins in registration with the apertures (12) in the backplane (10). The pin holder (134) is displaced towards the backplane (10) to insert the pins (14) into the apertures (12). As the pins are inserted, they are simultaneously engaged by a pair of guide fingers (244) which travel therewith to guide the engaged pins into the apertures without interfering with any previously inserted pins. The guide fingers disengage themselves from the pins once insertion thereof is substantially completed. An apparatus (10) is also described for carrying the above-described steps in sequence.

Abstract: An apparatus (44) for automatically inserting contact fingers (26) on an edge connector (14) into corresponding apertures (28) in a backplane (10) comprises a nest assembly (77) rotatably mounted to an end (74) of a transfer slide (73). The transfer slide (73) is mounted for movement along a path underlying a rotatable, multi-sided carousel (68), storing a stack of edge connectors on each side thereof, and a ram (49) overlying the backplane. When the transfer slide (73) is displaced to a side of the carousel (68), the nest assembly (77) will engage an endmost edge connector (14) stored on the carousel side. Upon displacement of the transfer slide (73) to the ram (49), the nest assembly (77) rotates to position the contact fingers (26) of the engaged edge connector for insertion in the apertures (28). The ram is then actuated to force the edge connector from the nest assembly towards the backplane to drive the contact fingers into the apertures.

Abstract: A technique is provided for calibrating a SCARA type robot (10) comprised of a first rotatable link (20) and a second link (32), rotatably connected at one end to the first link, and carrying a tool (40) at the other end thereof. The calibration technique relies on the fact that SCARA robots are controlled using a kinematic model, which, when accurate, allows the links to be placed in both a first and second angular configuration at which the tool (40) carried by the second link remains at the same position. To calibrate the kinematic model, the links are placed in the first configuration to locate the tool above a fixed datum point (60). Then, the links are placed in the second angular configuration to nominally locate the tool again in registration with the datum point. The error in the kinematic model is computed from the shift in the position of the tool from the datum point when the links are switched from the first to the second angular configuration.

Abstract: Automated inspection of solder bumps (18--18) on a major surface (14) of a chip carrier (10) is accomplished by placing the chip carrier on a platform (22) beneath a ring light (28) which is in registration with a television camera (30). Light from the ring light, which is directed at an angle towards all sides (12--12) of the chip carrier, is only reflected upwardly into the television camera by the solder bumps. The output signal of the television camera, which varies with the intensity of the light reflected from the solder bumps, is processed by a vision system (32) to obtain a one-dimensional plot of the light intensity. The one-dimensional intensity plot is analyzed automatically by the vision system to detect for missing, bridged or excessive solder bumps on the chip carrier.