Abstract: A method for producing beam leads, i.e. electrical contacts, on flexible circuits or multilayer circuits for interconnecting devices is disclosed. The method consists of processing a metal foil to expose a beam lead interconnection pattern, plating the exposed pattern with metal, coating a base insulating layer with an adhesive, punching cavities in the adhesive coated insulating layer, engaging the coated side of the base insulating layer to the metal foil, and applying a cushioning material on the opposite side of the adhesive coated insulating layer. The metal foil and the insulating layer are then laminated causing the cushioning material to flow into the pre-punched cavities thereby providing a protective cushioning-type backing for the metal-plated beam lead interconnection pattern.