Abstract: An array of microcrystalline silicon pads for a vidicon target is selectively grown, by the hydrogen reduction of silicon tetrachloride, along surface portions of a silicon wafer exposed through openings in an overlying silicon dioxide layer. The method disclosed avoids the spurious irregular growth of silicon on the silicon dioxide layer between the adjacent silicon pads.

Abstract: Mechanical retension of a lead having a core material with a ductile metal plating of lower melting temperature is provided within a receiving opening of a fired ceramic body by heating the lead within the opening of the ceramic body to a temperature between the melting temperature of the plating on the lead and the melting temperature of the core material of the lead. A charge of molten plating material is formed and cast thereby, substantially by capillary action, within an interstitial opening at the lead-ceramic interface substantially conterminous to surfaces of interior surface irregularities within the opening. Upon cooling, an integral lead-ceramic body is formed wherein the lead is anchored within its receiving opening substantially by the casting of the plating material within the surface irregularities.