Abstract: Method for removing a portion of the binder phase from the surface of a substrate that is composed of particles of at least a first phase joined together by the binder phase, and wherein the surface is etched by contacting it with a gas flow of an etchant gas and a second gas. The second gas is one or more gases that will not react with the substrate or the removed binder phase and will not alter the oxidation state of the substrate during etching.
Abstract: A flow sensor including a symmetrical sensor tube for carrying the fluid, first and second heaters symmetrically disposed at the sensor tube, and a first temperature sensor in thermal communication with the fluid. A flow meter including a flow sensor having a sensor tube, a first heater disposed at the sensor tube, a second heater disposed at the sensor tube, and a first temperature sensor in thermal communication with the fluid. The meter also includes a circuit for selectively applying power to the first and second heaters to maintain a temperature difference between a temperature of the first and second heaters and the temperature of the fluid, and for determining a difference in power supplied to the first and second heaters.
Type:
Grant
Filed:
October 13, 1997
Date of Patent:
October 3, 2000
Assignee:
Teledyne Brown Engineering, Inc.
Inventors:
William J. Alvesteffer, Yufeng Huang, Larry Eget