Patents Represented by Attorney, Agent or Law Firm R. Kaschak
  • Selective C4 connection in IC packaging
    Patent number: 6650016
    Abstract: In an integrated circuit package employing solder bump technology, a metal layer placed on the surface of a substrate below an array of bonding pads is split and displaced from its axis at selected locations to preserve electrical continuity, but to also lower the height of an insulating solder mask layer at those locations.
    Type: Grant
    Filed: October 1, 2002
    Date of Patent: November 18, 2003
    Assignee: International Business Machines Corporation
    Inventors: Stephen W. MacQuarrie, Irving Memis