Patents Represented by Attorney Rabin & Berdo
  • Patent number: 8296390
    Abstract: A customer for music distributed over the interne may select a composition from a menu of written identifiers (such as the song title and singer or group) and then confirm that the composition is indeed the one desired by listening to a corrupted version of the composition. If the customer has forgotten the song title or the singer or other words that provide the identifier, he or she may hum or otherwise vocalize a few bars of the desired composition, or pick the desired composition out on a simulated keyboard. A music-recognition system then locates candidates for the selected composition and displays identifiers for these candidates to the customer.
    Type: Grant
    Filed: March 18, 2010
    Date of Patent: October 23, 2012
    Inventor: Lawson A. Wood
  • Patent number: 7517230
    Abstract: An electrical contact assembly includes a first module (21a, 21b, 22) having a first set of electrical contacts, a second module (10) having a second set of electrical contacts, a shape generating module (32, 34, 36), and a clamping arrangement (24, 25, 26, 27, 28, 29) for clamping the first, second and shape generating modules together. The shape generating module (32, 34, 36) imparts a desired shape to the second module (10) for urging the second set of electrical contacts toward the first set of electrical contacts, such that clamping the modules together results in a positive contact force between the first and second sets of electrical contacts that is substantially uniform across the sets of electrical contacts. The shape generating module includes a first insulating layer (34), a second insulating layer (32) and a shape producing layer (36) disposed between the first and second insulating layers.
    Type: Grant
    Filed: June 2, 2008
    Date of Patent: April 14, 2009
    Assignee: International Business Machines Corporation
    Inventors: John Lee Colbert, Mark Kenneth Hoffmeyer
  • Patent number: 7089277
    Abstract: A computation circuit which can obtain n+m-digit accumulation results by using an n-digit computation unit. This computation circuit comprises a computation unit which performs additions of n-digit data; an m-digit up/down counter; and a control circuit which uses the up/down counter to generate the upper m digits of the computation result. In a preferred embodiment, the control circuit increments by one the up/down counter when carry-over occurs in the computation unit, and when the input data of the computation unit is negative, decrements by one the up/down counter. In another preferred embodiment, the control circuit increments or decrements by one the up/down counter when positive or negative overflow occurs in the computation unit, and decrements by one the up/down counter when the final computation result of the computation unit is negative or is a positive number greater than 2n?1?1.
    Type: Grant
    Filed: February 19, 2003
    Date of Patent: August 8, 2006
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Teruaki Uehara, Keitaro Ishida
  • Patent number: 6953897
    Abstract: A device and method for clamping and grounding a cable, includes a conductive cable clamp. The clamp is adapted to clamp and conductively engage a periphery of a conductive shield of the cable. In one aspect of the invention, the cable clamp includes a first conductive plate and a second conductive plate. Each of the plates has at least one groove formed therein. The first plate is positionable against the second plate so that the groove in the first plate and the groove in the second plate collectively form a hole extending from one edge of the cable clamp to an opposite edge of the cable clamp, with the hole accommodating the cable therein. In another aspect of the invention, the cable clamp includes a conductive flexible fabric having at least one pattern formed therein, with the pattern accommodating the cable therein.
    Type: Grant
    Filed: August 21, 2003
    Date of Patent: October 11, 2005
    Assignee: International Business Machines Corporation
    Inventors: Christopher Michael Marroquin, Mark James Jeanson, Don Alan Gilliland, Christopher Lee Tuma
  • Patent number: 6944560
    Abstract: A method for eliminating noise signals in a radio signal receiving device receives data containing a series n bits that include a plurality of noise signal bits. The voltage level of the noise signal bits is corrected based on the voltage level of the bits before and after the noise signal bits and is transformed to the same level as the bits before and after thereby to eliminate the noise signals. The method can correct damaged data bits and determine whether the width of data bits meets requirements to avoid erroneous determination when data are damaged.
    Type: Grant
    Filed: November 4, 2003
    Date of Patent: September 13, 2005
    Assignee: Lite-On Technology Corporation
    Inventor: Chin-Cheng Kuo
  • Patent number: 6731365
    Abstract: An array structure of a liquid crystal display is provided, comprising a substrate having a first and a second pixel region thereon. Each of the pixel regions has a transistor, a pixel electrode electrically connected to a drain of the transistor, and a common electrode forming a capacitance with the pixel electrode, wherein the common electrodes of the first and second pixel regions are electrically isolated from each other.
    Type: Grant
    Filed: November 30, 2001
    Date of Patent: May 4, 2004
    Assignee: Hannstar Display Corp.
    Inventors: Sheng-Hsien Lin, Po-Sheng Shih
  • Patent number: 6535187
    Abstract: Light is shined on an addressable spatial light modulator, and the light is also integrated. The data displayed on the spatial light modulator is changed when the integrated light reaches a predetermined value. The light may impinge on the spatial light modulator through a color wheel, which may be rotated faster than the frame repetition rate of video information that is being displayed. Alternatively, the light may be generated by different-colored lamps. The intensity of the light may be controlled in accordance with the bit rank or significance of the bits that are being displayed by the spatial light modulator. Several techniques for achieving different intensity levels are disclosed.
    Type: Grant
    Filed: April 21, 1998
    Date of Patent: March 18, 2003
    Inventor: Lawson A. Wood
  • Patent number: 6493831
    Abstract: A select circuit selectively outputs one of a transition indication signal that is the output of an edge sense circuit of an input timer, a transition indication signal that is an output of an edge sense circuit of an output timer, and a control signal for controlling output using software. The state of activation of a switch circuit for controlling transmission of a clock signal to a counter of the output timer is then controlled by the signal selected by the select circuit.
    Type: Grant
    Filed: October 7, 1999
    Date of Patent: December 10, 2002
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Hiroshi Saitoh
  • Patent number: 6491508
    Abstract: A molding die set includes a first molding die which comprises cavities and a parting surface; a second molding die which comprises cavities and a parting surface arranged to face the first molding die; and an O-ring supported on the first molding die to surround the cavities and to have a peripheral line which does not extend outwardly from the parting surface.
    Type: Grant
    Filed: October 13, 2000
    Date of Patent: December 10, 2002
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Shin Kurosawa, Akira Sugai
  • Patent number: 6472729
    Abstract: A semiconductor device chip packaged in the semiconductor device in accordance with this invention has one or more grooves engraved along the rear surface thereof to allow the grooves to receive one or more connection bars and a die pad or an island, if any, for the purpose to make the total thickness of the semiconductor device chip and the connection bar or bars and the die pad or the island, much thinner than the sum of the thickness of the semiconductor device chip and the thickness of the connection bar or bars and the die pad or the island, for the ultimate purpose to cause the finished or molded thickness of the semiconductor device in accordance with this invention to be as thin as 1.0 mm, resultantly allowing a semiconductor ingot having a diameter of 300 mm for producing a semiconductor device chip to be molded in the semiconductor device in accordance with this invention.
    Type: Grant
    Filed: November 10, 1998
    Date of Patent: October 29, 2002
    Assignee: OKI Electric Industry Co., Ltd.
    Inventor: Takahiro Oka
  • Patent number: 6472732
    Abstract: A ball grid array (BGA) package includes a substrate (20) having first and second surfaces. and through holes (30) passing through it. The package further includes a first semiconductor chip (28) which is mounted on the first surface of the substrate (20); a second semiconductor chip (36) which is mounted on the second surface of the substrate (20); and solder balls (34) which are provided on the first surface of the substrate (20) and are electrically connected to the first semiconductor chip (28). The second semiconductor chip (36) is electrically connected via the through holes (30) to the solder balls (34).
    Type: Grant
    Filed: March 21, 2000
    Date of Patent: October 29, 2002
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Makoto Terui
  • Patent number: 6459145
    Abstract: According to a typical invention of the inventions disclosed in the present application, a semiconductor chip with an electronic circuit formed therein is fixed to a die pad for a lead frame having projections formed on the back thereof, with an organic dies bonding agent. Pads on the semiconductor chip, and inner leads are respectively electrically connected to one another by metal thin lines. These portions are sealed with a molding resin. Further, each inner lead extends to the outside of the molding resin and is processed into gull-wing form for substrate mounting. Moreover, the inner lead is processed by soldering so that an external terminal is formed. Thus, since the projections are provided on the back of the die pad, the back of a packing material is brought into point contact with that of the die pad as compared with the conventional face-to-face contact. It is therefore possible to minimize the transfer of organic substances from the packing material.
    Type: Grant
    Filed: October 25, 2000
    Date of Patent: October 1, 2002
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Shigeru Yamada, Yasufumi Uchida, Noriko Murakami, Yoshinori Shizuno
  • Patent number: 6454273
    Abstract: A seal structure of the present invention is composed of a sliding member 2, a supporting member 1 which stores the sliding member 2 slidably, and a seal ring 5 provided between the sliding member 2 and the supporting member 1. The seal ring 5 is formed by a lip section 10 on which a pressure of a hydraulic operating fluid acts and a heel section 11 for supporting a working pressure. Since the seal structure is such that an annular pressure receiving area between an inner circumference and an outer circumference of the lip section 10 is smaller than an annular supporting area between an inner circumference and an outer circumference of the heel section 11, a pressure which acts on the seal ring 5 is reduced and deformation to a sliding surface side of the heel section 11 is prevented.
    Type: Grant
    Filed: October 5, 2000
    Date of Patent: September 24, 2002
    Assignee: Kayaba Kogyo Kabushiki Kaisha
    Inventors: Mituhiro Kashima, Sadaaki Hara, Masahide Kanda, Koji Mitushima
  • Patent number: 6450715
    Abstract: A push rod 50 is provided in a container body 4 and a cartridge 2 is attached to the container body 4 in such a manner that the cartridge 2 can be attached and detached. Due to rotations of the container body 4 and the cartridge 2, a feeding mechanism causes the push rod 50 in the container body 4 to spirally advance, pushes a core chuck member 20 in the cartridge 2, and causes a stick type cosmetic material retained at the core chuck member 20 to move forward and backward. The core chuck member 20 is always urged in a direction of retreat by a spring 3, and when the cartridge 2 is attached to the container body 4, the push rod 50 is pushed back by repulsion to an inside of the container body 4 so as to prevent the stick type cosmetic material from projecting out of the cartridge 2.
    Type: Grant
    Filed: May 17, 2001
    Date of Patent: September 17, 2002
    Assignee: Suzuno Kasei Kabushiki Kaisha
    Inventor: Atsushi Ohba
  • Patent number: 6422915
    Abstract: A dynamic collapsible and revolving toy includes a base with a gear seat fixedly disposed inside. A gear plate mounted on the gear seat is driven to rotate by a gearbox with a power outputting gear through engagements of a transmission gear, a reduction gear and an internal gear. There are an interior tube set and an exterior tube set disposed above the gear plate and protruded out the base. The innermost tube of the exterior tube set is connected to the innermost tube of the interior tube set and the outermost tube of the exterior tube set is mounted on the gear plate. Further a retractable strip coiled on the ring slot of the gear plate is connected to the innermost tube so that the interior tube set and the exterior tube set can rotate upon the gear plate. A plurality of collars are mounted outside the exterior tube set for hanging decorative articles. A control circuit inside the gear seat makes the gearbox capable of providing the clockwise or counter-clockwise and accelerated or decelerated rotation.
    Type: Grant
    Filed: March 7, 2001
    Date of Patent: July 23, 2002
    Inventor: Kun-Yueh Chen
  • Patent number: 6423904
    Abstract: A laminate printed circuit board of the present invention includes wirings respectively extending from terminals provided on the front and rear of the board. The wirings are each connected to an intermediate layer via a respective blind through hole. A wiring provided on the intermediate layer plays the role of a lead for plating. The circuit is capable of reducing a wiring area and noise.
    Type: Grant
    Filed: December 5, 1996
    Date of Patent: July 23, 2002
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Keiko Hayami
  • Patent number: 6410865
    Abstract: A mechanism for ejecting stylus includes the locking apparatus and the ejecting apparatus. When the stylus is put in the slide groove, the movable arm of the locking apparatus exactly hooks the rabbet of the stylus resulting in the retention of stylus. The ejecting apparatus is used for ejecting the stylus along the slide groove. The locking apparatus and the ejecting apparatus are set separately at the end of the slide groove, and the distance between two apparatus is exactly equal to the length of the stylus.
    Type: Grant
    Filed: March 16, 2001
    Date of Patent: June 25, 2002
    Assignee: High Tech Computer Corp.
    Inventors: Ta-Wei Liu, Chien-Min Lin
  • Patent number: 6398331
    Abstract: An apparatus for driving a printhead has a timer, a power supply, and a controller. The power supply applies a drive voltage to the printhead to eject ink drops from the printhead. The timer counts an elapsed time during which the printhead does not eject ink drops. The controller performs an ejection test where the drive voltage drives the printhead a plurality of times to eject a plurality of ink drops. The controller drives the power supply to increase the drive voltage in accordance with a length of the elapsed time. The ejection test is performed at a predetermined length of the elapsed time, the drive voltage and the predetermined length of the elapsed time are selected in accordance with a decrease in an ejection speed of the ink drops. The controller controls the drive voltage such that the surface of meniscus of ink in the orifice is subjected to fine vibration before the ink drop is ejected.
    Type: Grant
    Filed: February 4, 2000
    Date of Patent: June 4, 2002
    Assignee: Oki Data Corporation
    Inventors: Toshiyuki Asaka, Hideaki Ishimizu, Shigeru Tsunoda, Toshiro Suemune
  • Patent number: 6392958
    Abstract: An easily implemented SRAM compatible memory device usable as a low power asynchronous SPRAM and a driving method therefor. The method for driving the SRAM compatible memory device includes the steps of (a) inputting a leading address designating at least one of the plurality of memory cells, (b) generating an address transition detection signal in response to the input leading address, (c) allowing a predetermined DRAM access time to elapse after generation of the address transition detection signal, (d) performing an access operation of the DRAM memory array for the duration of the DRAM access time after step (c), and (e) inputting a lagging address different from the leading address after the lapse of a predetermined SRAM access time from the leading address input time. The SRAM access time is equal to or longer than twice the DRAM access time.
    Type: Grant
    Filed: April 2, 2001
    Date of Patent: May 21, 2002
    Assignee: Silicon7 Inc.
    Inventor: Sun Hyoung Lee
  • Patent number: 6392882
    Abstract: A holder for protecting a palmtop comprising of an activation button. When the activation button is depressed, it shuts down the palmtop which is removed from the holder by pushing it forward along the holder. The activation button comprises of an embossment, a boss, contact point, and trigger. The embossment connects with the palmtop tightly before the activation button is depressed while the boss is convenient for users to press the activation button. Moreover, the contact point will touch the trigger to shut down the palmtop after the active button is depressed.
    Type: Grant
    Filed: November 20, 2000
    Date of Patent: May 21, 2002
    Assignee: HTC Corporation
    Inventors: Ching-Shih Chen, Sheng-Ming Liu, Hsin-Chien Peng