Abstract: Polyimide optical waveguide structures comprising a core within a cladding wherein at least one of the core and the cladding is a polyimide containing 6FDA, BTDA, an aromatic diamine having bulky methyl groups ortho to the amine, and a co-diamine wherein the polyimides have the properties of low optical loss, low optical absorbance, controllable refractive index, and high thermal stability, and wherein the polyimides are photosensitive and solvent resistant.

Abstract: A chemical resistant copolymer useful in electronic applications, said copolymer is a polyimide containing a 3,3',4,4'-tetracarboxybiphenyl dianhydride (BPDA) moiety, at least one other dianhydride moiety, and at least one diamine.

Abstract: A wet-etch composition for polyamic acids and partially cured polyamic acids comprising an aqueous solution having a major portion of water, a substituted hydrocarbon solvent and a non-ionic base that is strong enough to deprotonate the polyamic acid or a partially cured polyamic acid in a weight ratio of 0.1-49:49-0.1, with the proviso that the composition contains less than 1.0 percent ionic base. The present invention further provides a process for wet-etching polyamic acids or partially cured polyamic acids.

Abstract: A group of polyimides and copolyimides made from 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) or 2,2-bis(3,4-dicarboxyphenyl)propane dianhydride (IPAN) their acid or ester forms and selected aromatic diamines are disclosed which are useful for substrate coatings and interlevel dielectrics in on-chip and multi-chip package applications. In such applications these polymers exhibit lower dielectric constant, lower moisture uptake and reduced dielectric constant variation with temperature and humidity than existing polymers, yet they are both thermally stable at required processing temperatures and can form suitably adherent, pinhole-free coatings on electronic component substrates.

Abstract: Epoxy resins containing epoxidized polybutenes and a process for preparing them are disclosed. The cured epoxy resin containing epoxidized polybutene is useful as a coating or a composite and demonstrates improved flexibility and ductility and improved chemical and water resistance with no loss in heat deflection temperature.

Abstract: A group of polyimides and copolyimides made from 6FDA, IPAN, or their acid or ester forms, and selected aromatic diamines are disclosed which are useful for substrate coatings and interlevel dielectrics in on-chip and multi-chip package applications. In such applications these polymers exhibit lower dielectric constant, lower moisture uptake and reduced dielectric constant variation with temperature and humidity than existing polymers, yet they are both thermally stable at required processing temperatures and can form suitably adherent, pinhole-free coatings on electronic component substrates.

Abstract: The invention relates to the preparation of novel dianhydrides of the formula: ##STR1## wherein R is a polyalkylated mononuclear aromatic radical, preferably a phenylene radical. The mononuclear aromatic radical may be substituted with from three to four lower alkyl radicals, preferably C.sub.1 -C.sub.4 alkyl radicals. The dianhydrides are preferably made by the reaction of a monoanhydride monoacid halide and a polyalkylated mononuclear aromatic in the presence of a Friedel-Crafts catalyst under Friedel-Crafts reaction conditions. These dianhydrides ae useful reactants in the preparation of polyimides and epoxy curing agents.

Abstract: Novel polyetherimide copolymers comprising the reaction product of 2,2-bis(3',4'-dicarboxyphenyl)propane dianhydride, an aromatic bis(ether anhydride), and a diamine are described. The polyetherimide copolymers have improved thermal properties, are soluble in conventional solvents, and are compatible with other engineering resins.

Abstract: A first reactor is used to graft polystyrene to a rubber-like polymer. A second reactor is used to obtain a mixture of styrene and polystyrene. The effluent from both the first and the second reactors are fed into a quiescent reaction zone where phase inversion occurs. The phase inverted material is fed into post inversion reactors to substantially complete the polymerization of the styrene monomer, and any unreacted styrene monomer is driven off to form the improved high-impact polystyrene.

Abstract: A wet-etch composition for polyamic acids and partially cured polyamic acids containing an aqueous solution having a major portion of water, a substituted hydrocarbon solvent and a non-ionic base that is strong enough to deprotonate the polyamic acid or a partially cured polyamic acid in a weight ratio of 0.1-49:49-0.1, with the proviso that the composition contains less than 1.0 percent ionic base. The present invention further provides a process for wet-etching polyamic acids or partially cured polyamic acids.

Abstract: A process for the preparation of hydrogenated deodorized polybutene polymers, wherein the polybutene polymer is hydrogenated, distilled to substantially remove low boiling odorous compounds, and treated with silica gel to substantially remove the remaining odorous compounds thereby providing an improved hydrogenated, distilled, silica gel-treated polybutene polymer substantially free of odorous compounds.

Abstract: The invention relates to sheet molding compounds having improved viscosity control comprising polyester-polyurethane hybrid resins formed by the reaction of an A side composition and a B side composition. The A side composition comprises a polyfunctional isocyanate compound and a free radical polymerization catalyst. The B side composition comprises a mixture of (i) an ethylenically unsaturated monomer solution having no active hydrogen groups which has dissolved therein about 40-90 weight percent of a substantially water-free, unsaturated polyester polyol having at least one dicarboxylic alkene moiety and having an acid number less than five; and (ii) a methacrylate ester of a C.sub.2 -C.sub.10 alkylene diol.

Abstract: Polyester-polyurethane hybrid resin molding compositions having a first, soft polyurea phase within a second, more rigid polyester-polyurethane phase are disclosed. The compositions are formed by the reaction of an A side composition and a B side composition. The A side composition comprises a polyfunctional isocyanate compound and a free radical polymerization catalyst. The B side composition comprises a mixture of (i) an ethylenically unsaturated monomer solution having dissolved therein about 40-90 weight percent of a substantially water-free, unsaturated polyester polyol having at least one dicarboxylic alkene moiety and having an acid number less than five; and (ii) a polyfunctional nitrogen-containing compound having at least one active hydrogen atom on each of at least two nitrogen atoms in each molecule, which, when reacted with the A side composition, has a molecular weight sufficient to form the first, soft polyurea phase.

Abstract: A polyimide layer having a thickness greater than about 5 microns is formed on a substrate by coating a substrate with a solution of polymer and a solvent of the formula ##STR1## wherein R.sub.1 and R.sub.2 are independently a hydrogen, a C.sub.1 to C.sub.6 alkyl moiety, or a ##STR2## R.sub.5 is a C.sub.1 to C.sub.6 alkyl moiety; and R.sub.3 and R.sub.4 are independently hydrogen or a C.sub.1 to C.sub.6 alkyl moiety, and curing the resulting coated substrate.

Abstract: Novel maleic anhydride catalysts comprising phosphorus-vanadium oxides and phosphorus-vanadium-co-metal oxides which under reaction conditions for the manufacture of maleic anhydride from butane feedstock do not expand to the point of crushing and producing fines.

Abstract: Polyimides useful in multilayer electronic devices containing the 4,4'-bis(4-amino-2-trifluoromethylphenoxy) biphenyl moiety have low dielectric constants, low moisture uptake, high thermal degradation stability, low glass transition temperature.

Abstract: Amorphous polyamide compositions are provided which are transparent and have improved glass transition and thermal decomposition temperatures. The polyamide compositions of the present invention can be prepared as the polymeric condensation product of a diamine component comprising neopentyldiamine, and a diacid component comprising an aromatic dicarboxylic acid.

Abstract: Compounds are disclosed which are anhydrides containing additional carboxylic acid moieties and dianhydrides of disubstituted maleic anhydride compounds wherein the acid anhydrides and dianhydrides retain their alkene character. These compounds are useful as precursors for polyesters, thermally stable polyamide-imides and polyimides.

Abstract: A low modulus, solvent resistant, wet etchable polyimide useful in electronic applications as passivation and insulating coatings, said polyimides containing a 4,4'-bis(p-aminophenoxy)biphenyl moiety, a siloxane diamine moiety, and a dianhydride moiety.

Abstract: A low modulus, solvent resistant, wet etchable polyimide useful electronic applications as passivation and insulating coatings, said polyimides containing a 4,4'-bis(p-aminophenoxy)biphenyl moiety, a siloxane diamine moiety, and a dianhydride moiety.