Abstract: A multi-chip module and a method for manufacturing the multi-chip module. A first semiconductor chip is mounted to a support substrate and a second semiconductor chip is mounted to the first semiconductor chip. The second semiconductor chip has a smaller dimension than the first semiconductor chip. A spacer is coupled to the second semiconductor chip. Bonding pads on the first and second semiconductor chips are wirebonded to bonding pads on the support substrate. A third semiconductor chip is mounted to the spacer and bonding pads on the third semiconductor chip are wirebonded to bonding pads on the support substrate.

Abstract: A computer-implemented method and system for analyzing performance of financial securities consistent with a long-term investment strategy, the method utilizing a computer system for inputting investment parameters pertaining to a security of interest and interactively utilizing the computer to calculate an internal rate of return for the security and outputting investment and performance information comprising market value of said investment, time-weighted internal rate of return of said investment, cumulative investment amount and cumulative number of shares of security purchased at the end of a specified time period.