Abstract: A dispenser of film units is operative with a film processing apparatus enclosed within a housing. The housing includes a front sidewall having an exit slot for the delivery of film units, the dispenser including a film ejection device located behind the slot for ejecting film units out of the housing via the slot. The ejection device may include rotating pressure rolls which may also serve a function in the film processing. The dispenser includes a catcher constructed of a four-bar mechanical linkage, and includes a spring urging the catcher from an extended state away from the sidewall to a retracted state contiguous to the sidewall. The catcher is supported pivotally by a strut assembly which pivots from the sidewall and connects to pivots on both the catcher and the sidewall. A flap interconnects the tray with the sidewall. An articulation pivot permits a folding of the flap against the tray during retraction of the catcher.

Abstract: Improved digital image processing circuitry for sharpening edges and details of a recorded image digitally while minimizing the amplification of noise in the input recorded image provides an output recorded image which is the sum of chrominance signals processed by color processing circuitry and luminance signals processed by color processing circuitry and sharpness circuitry. Input recorded images are provided for concurrent parallel processing by both the color processing circuitry and the sharpening circuitry in a manner whereby the color processing circuitry generates low spatial frequency luminance signals and the sharpness circuitry generates high spatial frequency luminance signals both of which are subsequently combined to provide an output signal in which the amplitude of the high spatial frequency noise component associated therewith is minimized.

Abstract: An up converting method and apparatus includes a crystalline structure responsive to light emitted from pump light for producing visible and/or ultraviolet light therefrom which is of a shorter wavelength than the pump light. This crystalline structure comprises a composition containing active ions of trivalent rare earth elements and a host material of either anhydrous rare earth halides or rare earth oxysulfides. This crystalline structure is represented by the atomic formula M.sub.(1-x) R.sub.x Z.sub.3 or M.sub.2(1-x) R.sub.2x O.sub.2 S where M comprises at least one rare earth element selected from the group comprising cerium, gadolinium, yttrium, lanthanum, and mixtures thereof, R is a dopant selected from the group comprising neodymium, thulium, erbium, holmium, samarium, and mixtures thereof, x is a value in the range from 0.005 to 1.0, and Z is a halogen selected from the group comprising chlorine, bromine, and iodine.

Abstract: An electrostatic discharge protection device is disclosed for use with a printed circuit board (hereafter referred to as "PCB") of the type having a major portion and a dependent integral tongue having oppositely disposed PCB surfaces with conductor pads disposed thereon. The electrostatic discharge protection device comprises a first hinge structure and a second hinge structure mounted to corresponding PCB surfaces. Each hinge structure has a base section securely mounted to the PCB surface, an elongated arm section pivotally connected to the base section and having an electrically conductive bar disposed along the length thereof, and means for urging the electrically conductive bar against and into electrical interconnection with the conductor pads while the PCB remains disconnected from a complementary edge connector.

Abstract: A plurality of electrostatic discharge (hereafter referred to as "ESD") protection devices are disclosed for use with semiconductor chip packaging (hereafter referred to as "SCP"). The electrostatic protection devices comprise electrically conductive shorting devices that may be removably connected to the SCP during the manufacture to short selected pins from the SCP. The ESD protection devices remain in place to provide ESD protection during all phases of handling and shipping and may be either automatically unshorted or be manually removed during final assembly when the SCP is installed in its end product.

Abstract: A plurality of electrostatic discharge (hereafter referred to as "ESD") protection devices are disclosed for use with semiconductor chip packaging (hereafter referred to as "SCP") of the type having a top surface, a bottom surface, and, disposed between the top and bottom surface, a plurality of interface surfaces having a plurality of connector pins disposed thereon. In one embodiment, the ESD protection device comprises a base section secured to the top surface of the SCP and a plurality of integral shorting arms each extending outward from the top surface in spaced apart relationship with respect to each other and in spaced apart alignment with respect each of the connector pins. Each shorting arm has a first portion which is integral to the base section and a distal end portion integrally connected with the first portion and extending outwardly therefrom.