Abstract: Contaminant particles in a vacuum plasma processing chamber can be removed from the surface of a substrate in the chamber by first reducing the pressure in the chamber so as to elevate the particles above any obstruction about the substrate, including a clamping ring and the like, maintaining a plasma from a gas fed to the chamber so that the particles are in the plasma, and then increasing the gas flow to the chamber so as to sweep the particles out of the chamber through the exhaust system of the processing chamber while maintaining a plasma in the chamber.

Abstract: The present invention provides an apparatus for semiconductor processing in which the reactor chamber and the vacuum conduit means connected to the chamber are coated with a film of halogenated polymer material having a low vapor pressure and a low sticking coefficient. Preferred materials include low molecular weight polyfluoroethylene polymers such as polytetrafluoroethylene and polychlorotrifluoro-ethylene. A method is provided to prevent contaminant buildup on coated surfaces of semiconductor processing chambers and vacuum conduit means connected thereto during processing of a workpiece.

Abstract: An improved particle monitoring sensor is described which uses a variety of techniques to prolong the effective life of the optical surfaces within the particle monitoring sensor. Substantially inert purging gas is directed over the particle monitoring sensor windows, which are normally exposed to a harsh operating environment. The surfaces of these windows are heated by heating elements in direct thermal contact with the windows. In addition, a restrictive slit is placed over the detector window to reduce the exposed area and to increase the velocity of gas flowing over the window surface. While this slit reduces the detector's field of view, the signal loss is reduced by using a linearly polarized light source and aligning the elongated slit's major axis with the direction of polarization.

Abstract: A system is disclosed that allows a computer system within a network environment to determine whether a data packet is to be processed by a particular computer system. This is accomplished through an address matching scheme that provides for an LED indication that the computer is to utilize the data packet provided by the network. In so doing, the system provides more capability to the computers on a network to operate more efficiently.

Abstract: A high performance hermetic integrated circuit package assembly for housing an integrated circuit die wherein the package assembly affords substantially reduced ground bounce within the integrated circuit. The package assembly includes a lead frame of electrically conductive material having a first predetermined pattern of outer leads and a second predetermined pattern of, integrally connected, inner leads for providing interconnection to the die through a plurality of contact pads thereon, a series of electrically conductive wires connecting selected ones of the contact pads to selected ones of the inner leads, a base for mounting the die and includes a first layer of glass for supporting the lead frame and, a cap with a second layer of glass for reacting with the first layer of glass to provide a hermetic enclosure for the die.