Abstract: A method of assembling an integrated circuit component onto a substrate by the use of a polymer adhesive having fluxing properties and a specified adhesive strength and temperature control volumetric change which is greater than that of a solder to be used between terminals of the component to terminals of the substrate. In the method the uncured polymer adhesive is located between the circuit component and the substrate and as the second component moves into its site position upon the substrate, the uncured polymer adhesive is compressed and is displaced outwardly from between the body of the component and the substrate. In the method, as an exterior force is required to displace the adhesive in this manner, glass microspheres are provided within the adhesive to limit the movement of the integrated circuit components towards the substrate.

Abstract: An electronics enclosure includes an assembly of wall elements having metallic surfaces with a standard oxidization potential within the range of -0.25 to +0.5 volts, the wall elements rigidly secured together, and having a coating of molybdenum phosphate covering the metallic surfaces of the wall elements and providing electrical discharge continuity around the enclosure. The molybdenum phosphate coating provides a required degree of electrical conductivity for adequate electrostatic discharge thereby providing a Faraday cage to filter out any electromagnetic radiation attempting to pass through the enclosure. Of particular importance in the structure is the feature that the molybdenum phosphate is particularly effective as an electromagnetic interference element at junctures between wall elements of the enclosure. The molybdenum phosphate coating may be applied to the wall elements either prior to assembly or following assembly.

Abstract: A method and apparatus for use in performing non-contact analytical evaluation of a semiconductor wafer, which needs to be kept clean, to be performed outside of clean room facilities. The apparatus maintains a clean environment surrounding the semiconductor wafer and a portion of the apparatus is substantially transparent to a probe beam of electromagnetic radiation such as X-rays and visible light. The invention substantially overcomes the expenses associated with locating analytical test equipment for testing semi-conductor wafers within clean room facilities.