Patents Represented by Attorney Reinhold Cohn and Partners

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  • Method of cross-section milling with focused ion beam (FIB) device
    Patent number: 7427753
    Abstract: A method of milling a cross section of a wafer and a milling device. The method includes a coarse scanning of at least two milling frames and a fine scanning of at least one milling frame. The milling device is adapted to cross-section milling of a wafer, said milling includes a coarse scanning of at least two milling frames and a fine scanning of at least one milling frame.
    Type: Grant
    Filed: June 16, 2005
    Date of Patent: September 23, 2008
    Assignee: Applied Materials, Israel, Ltd.
    Inventor: Asher Pearl