Abstract: An interconnect system for providing electrical connection to bond pads of a semiconductor device (14) includes a socket (18) having a plurality of conductors (16) and a carrier assembly (10) receivable in the socket (18) carrying a semiconductor device (14). The carrier assembly comprises a substrate assembly (12) and a latch assembly (22, 122, 222). The substrate assembly (12) includes a substrate (12a) having a complaint membrane (12f) and a plurality of contact bumps (12i) on a top surface of the complaint membrane (12c) for contacting bond pads on the semiconductor device (14). The force applying latch assembly (22, 122, 222) applies pressure in making a temporary electrical connection between contact bumps (12i) and the bond pads of semiconductor device (14). Latch assembly (222) comprises a latch (232) which cooperates with a spring (231) to place a force on a lid (224, 324, 424) which in turn places a force on the semiconductor device (14).

Abstract: A flow regulating valve for air conditioning systems is shown in which a body member (26, 26a-26e) is provided with a passageway (28, 28a-28f) which results in regulating flow of refrigerant into the evaporator of the air conditioning system under normal conditions. Under severe operating conditions, e.g., high ambient temperature and low or idle speeds, the system refrigerant pressure rises. This increases pressure in the evaporator and an increase in the saturation temperature of refrigerant in the evaporator. This increase in temperature is sensed by a thermostatic metal element (44, 80, 88) of the regulating valve which moves to increase restriction to the flow of the refrigerant fluid through the valve thereby decreasing pressure of the refrigerant entering the evaporator.

Abstract: There is disclosed a multi channel GPS digital signal processor on a single IC. Each channel contains circuitry to process L1 or L2 P(Y) and C/A-code signals. In addition a search processor is included to achieve fast signal acquisition. Low power adder/accumulators have been designed to provide for a high precision digital oscillator whose output is synchronous to a high speed clock. The IC contains a full low power null detector and eight correlators to aid in signal acquisition.

Abstract: A socket for testing integrated circuit (IC) packages (100) has a lower block (10) with a plurality of contact elements (11) movable between open and closed positions mounted therein, an upper block (20) fixed on the lower bock (10) and formed with a lead insertion hole (21) for the insertion of each lead (101) of the IC package (100), a cover member (30) adapted for vertical, up and down movement relative to the upper block (20), and a spring biased slide block (40) mounted to slidably reciprocate in a recess formed between the upper and lower blocks (10,20) in a direction which crosses, at approximately a right angle, the direction in which a lead (101) of an IC package (100) would be inserted into an opened contact element (11). The slide block (40) has a plurality of apertures (41) for opening and closing contact elements (11) upon movement of the cover member (30) by the use of a contact part opening and closing element (50) converting movement of the cover (30) to sliding action of the slide block (40).

Abstract: A burn-in socket is shown including a latch member (60) capable of moving leads (101) of an IC package (100) received on a seat (200) on a base member (20), biasing the leads into engagement with movable contact arms (212) of contacts (21) mounted in the base member. A linking mechanism (50), movable in dependence upon the vertical movement of a cover member (30), transmits the cover member movement to latch member (60). Linking mechanism (50) has an arm (52) pivotably connected at one end to the cover member (30) and at an opposite end to a lever body (54) intermediate opposite ends thereof. The lever body has one end pivotably connected to base member (20) and its opposite end connected to latch member (60). A return spring (40) places a bias on the cover to maintain it normally separated from the base member and provides a selected contact force. The socket can be used with a wide variety of IC package types either before or after leads extending from the IC package have been formed.

Abstract: A socket for mounting an electrical part 30 in a freely detachable manner in which the electrical part 30 has a plurality of terminal leads 30a of a prescribed pitch P between the leads 30a has socket terminals 52 fixed in the socket and flexible electroconductive parts 38 corresponding to the pitch of the terminal leads on an insulating substrate 40 for making electrical contact with the terminal leads 30a of the electrical part 30 and the fixed socket terminals 52.