Abstract: A process for fabricating a semiconductor device, including providing a semiconductor substrate; depositing on the semiconductor substrate a layer of a high-K gate dielectric material; depositing on the gate dielectric material layer a polysilicon or polysilicon-germanium gate electrode layer, in which the step of depositing the polysilicon or polysilicon-germanium gate electrode layer includes providing non-reducing conditions in a CVD apparatus.
Type:
Grant
Filed:
February 27, 2002
Date of Patent:
September 17, 2002
Assignee:
Advanced Micro Devices, Inc.
Inventors:
Arvind Halliyal, Robert Bertram Ogle, Jr., Joong S. Jeon, Fred Cheung, Effiong Ibok