Abstract: This invention relates to apparatus for use in connection with material such as fluxed, woven, copper ribbon, sometimes called "desoldering braid" to capture and removed unwanted, molten solder from electronic components. A preferred embodiment comprises a hand-held desoldering braid gun having a handle in which a supply of desoldering braid may be stored, a finger trigger actuated pincer-type cutter positioned in the mouth of the "barrel" of the gun, a guide conduit for forming a path for desoldering braid coming from the handle through the cutter, and a thumb-actuated drive mechanism for moving desoldering braid to and fro past the cutters. Another embodiment includes a handle to receive a pre-packaged cassette of desoldering braid.