Abstract: The invention discloses a high density semiconductor package. Two semiconductor chips are each affixed on a corresponding one of two lead frames. The semiconductor chips and the lead frames are encapsulated, wherein only a portion of the leads of the lead frames protrudes and extends from the package.

Abstract: An integrated circuit for use with a plurality of clock oscillators. The integrated circuit has a semiconductor chip, function performing circuitry fabricated on the semiconductor chip and responsive to clock pulses provided thereto, and a semiconductor chip package having pins connected to the function performing circuitry. The integrated circuit further has a register accessible via the pins for external entry of clock control information. A clock control circuit responsive to the clock control information entered in said register has inputs connected to pins for the clock oscillators. The function performing circuitry is connected to the clock control circuit so that clock pulses are provided to the function performing circuitry by the clock control circuit in accordance with the clock control information entered in the register. Other integrated circuits, palette devices, computer graphics systems, printer systems and methods are also disclosed.