Abstract: A complementary metal oxide semiconductor PLL includes an input for receiving a reference frequency and a feedback loop for determining a phase error based on the reference frequency. The feedback loop includes a calibration DAC (amplifier with a digital gain control input) and a bandwidth DAC in series. The ICO controller is well known in control theory as a PI or proportional-integral controller. A proportional path supplies a proportional signal to the calibration amplifier and an integral path supplies an integral signal (a signal that is integrated in time) to the calibration amplifier.

Abstract: An impedance controller comprises impedance control logic outputting an adjustable impedance and a comparator comparing the adjustable impedance with a reference voltage. The impedance control logic recalibrates said adjustable impedance only when said comparator indicates a change in impedance.

Abstract: A device and method are provided for indicating a status of sixty-six input signals. The device may include a plurality of pre-sum circuits that receive the sixty-six input signals. Each pre-sum circuit may output two pre-sum output signals. The device may also include a plurality of first stage circuits. Each first stage circuit may receive two pre-sum output signals and output two first stage output signals. The device may also include a plurality of second stage circuits adapted to receive the first stage output signals. Each of the second stage circuits may output second stage output signals. A final stage circuit may be adapted to receive the second stage output signals and output two final stage output signals. The two final stage output signals represents the status of the sixty-six input signals such as whether at least three of the input lines have failed.

Abstract: A digitally controlled oscillator includes an adjustable signal generating circuit adapted to generate an oscillation signal. A feedback loop receives the oscillation signal from the adjustable signal generating circuit. The feedback loop detects error in the oscillation signal and produces an error signal based on the error. The control logic circuit receives the error signal from the feedback loop and maintains the oscillation signal within a predetermined error range. Also, a state device that is connected to the adjustable signal generating circuit maintains a previous operating state of the adjustable signal generating circuit when the digitally controlled oscillator is temporarily powered down.

Abstract: A current sensing circuit connected to a power supply terminal and having at least one input terminal and at least one output terminal includes at least one bipolar transistor having a base, emitter and collector, at least one current mirror amplifier connected to the power supply terminal, the current mirror amplifier having an input connected to the collector and having at least one output connected to the emitter, and a DC voltage source connected to the base.

Abstract: A method and structure for performing capacitance extraction during the design of an integrated circuit includes inputting a specified wiring density and design requirements, determining a minimum spacing for wire segments based on the design requirements, calculating a transparency factor based on the wiring density, calculating a lateral capacitance assuming virtual wires are present in the integrated circuit, and calculating a vertical capacitance based on the transparency factor.

Abstract: A method and structure for an integrated circuit including a differential amplifier having at least two inputs and at least two outputs; a pair of first resistors, each of which is coupled to one of the inputs; a pair of first source followers, each of which is coupled to one of the first resistors; a pair of second source followers, each of which is coupled to one of the out puts; a pair of second resistors, each of which is coupled to one of the second source followers and to one of said inputs; and a gain device connected between the first resistors and the first source followers.

Abstract: A structure for an amplifier circuit which includes a pair of source-coupled differential transistors, each of source-coupled differential transistors having a body and a gate, and input transistors electrically connected to the source-coupled transistors. Also, the input transistors load the body and the gate of the source-coupled transistors with positive feedback signals. As a result, a differential gain is increased and a common mode gain is not increased. The output of the pair of source-coupled differential transistors is directed to second pair of transistors. The second pair of transistors generates mirrored voltages which track with input voltages. The second pair of transistors generates mirrored voltages translated by an offset voltage to values near ground, mirrored voltages which represent a voltage gain over an input voltage, and mirrored voltages which are largely differential and includes approximately no common mode input voltage.

Abstract: A structure and method for reducing bipolar current in of a SOI circuit by alternating precharge low and precharge high methodologies comprises a reset signal source coupled to an inverter and a primary node, further coupled to a first and second PFET device; a clock signal source; coupled to a first NFET device and a third PFET device; a first input signal source coupled to a second NFET device and a fourth PFET device; a first NFET stack node coupled to the third PFET device, the first NFET device, the primary node, and the second NFET device; a second input signal source coupled to a third NFET device; a fifth PFET device coupled to the fourth PFET device; a power supply voltage source coupled to the fifth PFET device; and a second NFET node coupled to the fourth PFET device, the second NFET device, and the third NFET device.

Abstract: A structure for a semiconductor chip which includes a first region having first cells for storing and processing data, and a second region outside the first region having OPC structures, wherein the OPC structures comprise decoupling capacitors. The line widths of the active gates of first cells are the same size or similar in size as the OPC structures. The OPC structures reduce proximity effects of active devices in the first cells, and comprise N-type FETs and P-type FETs, that are located in the second region. The OPC structures may have a width greater than the first cells. The second region can be multiple OPC structures, whereby the second region comprises multiple decoupling capacitors. The active devices in the first cells are separated by a first distance and the OPC structures are separated from the active devices by the first distance.

Abstract: A method and structure for content addressable memory structure having a memory array of words, each word having multiple memory bits and a plurality of matchlines. Each of the matchlines is connected to one of the words and a matchline compare circuit is connected to the matchlines and is adapted to test all of the words individually. The matchline compare circuit includes a plurality of comparators equal in number to a number of the words, such that each word is connected to a dedicated comparator to allow each word in the memory array to be individually tested.

Abstract: A method and structure for a body coupled driver circuit includes a pull-up stage having a first transistor and a pull-down stage having a second transistor. The first transistor and the second transistor have bodies coupled to either a reference voltage or a pad node.

Abstract: A method and structure for forming an integrated circuit wafer comprises forming a substrate having first and second portions, depositing a first insulator over the substrate, patterning the first insulator such that the first insulator remains only over the first portion, depositing a second insulator over substrate (the first insulator has different thermal dissipation characteristics than the second insulator), polishing the second insulator to form a planar surface, and attaching a silicon film over the first insulator and the second insulator.