Abstract: A back light display assembly is disclosed comprising a dielectric body having a cavity extending therethrough profiled for accepting a pair of contact components. The contact components each comprise a planar body having an upwardly-directed resilient finger at one end, and an insulation displacement structure at the opposite end which projects through the dielectric housing cavity to a bottom surface thereof. The pair of resilient contact component fingers are positioned so as to receive a light-emitting diode semiconductor chip therebetween, and a pair of conductors are engageably mated to respective insulation displacement structure of the contact components to effectuate an electrical path to the semiconductor chips. The dielectric body is packaged within a receptacle having an interior chamber which receives the dielectric body therein.