Abstract: A low profile and light weight keyboard for portable electronic devices, such as notebook computers. In specific embodiments, the present invention provides a low profile keyboard 218 where the keycap engaging members 202 extend unobstructed below the back plate or circuit board 204. The travel of the key below the back plate may be eliminated from the overall stowed keyboard thickness by popping up the keyboard or otherwise extending the keyboard to a deployed position having sufficient thickness to accommodate the travel of the engaging members 212 below the base 204.

Abstract: A system and method for real time internal bus monitoring of a data processing device is disclosed. A plurality of processors having address outputs, data lines, and clocks are connected to a synchronizing circuit to lock the clocks of the processors in phase. A memory is connected to all of the data lines in common and is connected to the address outputs of fewer than all of the processors. Emulation circuitry is connected to the address outputs of a processor instead of said memory. The method discloses synchronizing the processors by locking the clocks in phase. Then accessing the system memory by addressing it with the address output of only one of the processors. And finally, monitoring at least one of the other processors via its address output.

Abstract: An wire bonding apparatus for forming ball and stitch bonds includes a bond head (42) having a shaved capillary (20), a carrier (43) for holding the bond head (42), a bearing (44) on which the carrier (43) is mounted, and a bearing table (46) on which the bearing (44) is mounted. The bearing table (46) and bearing (44) provide rotary movement about a z axis for the capillary (20). An x-y table (48) on which the carrier bearing table (46) is mounted provides movement in x and y directions for the capillary (20). A fixed work holder (50) supports a semiconductor die (11) and a leadframe (52) adjacent the capillary (20). The relative rotation provided between shaved capillary (20) and work holder (50) provides proper orientation of the capillary (20) with respect to leadframe (52) to form high quality stitch bonds on leadframe (52) while permitting fine pitch ball bonds to be formed on the semiconductor die (11).

Abstract: A method is provided for forming a thermally enhanced molded cavity package of a type which includes a lid and which is for housing a microcircuit chip. The molded package includes a heat spreader and a lead frame. The method includes the steps of attaching the lead frame to one surface of the heat spreader. A mold press is secured or clamped to-the lead frame and to the opposite surface of the heat spreader. Molding compound is injected into the press to form the package body having an upper and a lower section. During molding, a cavity is provided in the package body having the first surface of the heat spreader as a cavity floor and a lid seat is constructed in the upper section of the package body for maintaining a lid received thereon substantially parallel with respect to the cavity floor. The heat spreader is bonded to at least one of the package body sections and to at least one of the leads of the lead frame.