Abstract: Novel curing agents for heat-curable single package epoxy resins, the agents being adducts of aminoalkyl imidazoles with isocyanates. Cures are effected on heating the epoxy resin for times as short as 5 seconds.

Abstract: This invention is directed to the reaction product of an O-epoxyalkylated tetrakis (hydroxyphenyl) alkane resin with a phenol, which is used either as an upper layer over a lower layer of a diazo resin in a bi-layer system or as a homogeneous mixture with a diazo resin in a mono-layer system to provide a water-developable, negative-working, lithographic printing plate.

Abstract: The present invention relates to the manufacture of printed circuit boards and, particularly, to a process of miniaturizing said printed circuit board.

Abstract: A one component, solventless, storage stable, low temperature, curable urethane composition comprising(1) a branched, blocked isocyanate prepolymer comprising the reaction product of a polyol having a functionality of at least 2, an aromatic polyisocyanate having a functionality of at least 2, the combined functionality of the polyol and the polyisocyanate being greater than 4 and a ketoxime blocker;(2) a polyol crosslinking agent containing at least two OH groups;(3) a deblocking and curing catalyst for (1); and(4) a dessicant.The composition on heating to 100.degree.-120.degree. C. results in a cured polyurethane within 10-30 minutes. The composition can also be combined with polymeric powder, e.g., polymethylmethacrylate to yield cured reactive plastisols. The aforesaid compositions are useful as sealants, coatings or adhesives.

Abstract: A heat activatable adhesive or sealant organic resin composition comprising(1) a liquid, ethylenically unsaturated monomer, oligomer or prepolymer of the formula: ##STR1## wherein R is H or CH.sub.3, R.sub.1 is an organic moiety and n is at least 2,(2) a thermal initiator selected from the group consisting of substituted or unsubstituted pinacols, azo compounds, thiurams, organic peroxides and mixtures thereof, and(3) a thermoplastic adhesive material selected from the group consisting of polyesters, polyvinyl acetals, polyamides, butadiene-acrylonitrile copolymers, styrene-butadiene copolymers, styrene-isoprene copolymers, styrene-ethylene-butylene copolymers, ethylene-vinyl acetate copolymers, ethylene-ethyl acrylate copolymers, ethylene propylene diene monomer and mixtures thereof.The composition after application to the parts to be bonded or sealed forms a thermoset bond or seal on application of heat thereto, preferably by electromagnetic techniques including dielectric and induction heating.

Abstract: This invention relates to a moisture curable, isocyanate terminated, branched prepolymer which is the reaction product of (a) an alcohol having two or three --OH groups, (b) a hydrophobic polymeric diol or triol and (c) at least one polyisocyanate, said prepolymer having an NCO content in the range 0.3 to 1.0 meq/q. Exposure of the prepolymer as a coating on a substrate to moisture under atmospheric conditions results in a cured coating having excellent adhesion to the substrate and excellent abrasion resistance.

Abstract: This invention relates to the use of compositions of the formula: ##STR1## wherein n is 2 to 4 and X is --O--, --S-- or ##STR2## wherein R.sub.1 is an aliphatic or aromatic moiety as a curing agent for epoxy resins to form a thermoset material which has a reduced shrinkage.

Abstract: This invention provides a novel storage stable, heat curable, coating composition comprising(a) a ketoxime blocked polyisocyanate,(b) a polyol containing 2-4 terminal OH groups,(c) at least one ethylenically unsaturated monomer, oligomer or prepolymer of the formula: ##STR1## wherein R is H or CH.sub.3, R.sub.1 is an organic moiety and n is 1 and preferably at least 2,(d) a free radical thermal initiator for (c), and(e) a deblocking and curing catalyst for (a).The reaction between (a) and (b) in the composition results in a thermoset material which is believed to form an interpenetrating network with the resulting thermoset from (c) on thermal curing.The coating composition which is airless sprayable, storage stable and can be cured at low temperatures (about 80.degree.-120.degree. C.) provides a coating having good adhesion to metal surfaces with good abrasion resistance and good corrosion protection.

Abstract: This invention relates to novel heteromacrocyclic compounds which have electrochemically reducible sidearms containing uncharged Lewis basic donor groups appropriately placed to interact with a macroring-bound cation and an electrochemical switching process utilizing same. Reduction of the sidearm's aromatic residue produces a radical anion species. The resulting ligand binds a cation more strongly than does the neutral species. These compounds are therefore of utility as electrochemically controlled cation binders.

Abstract: This invention relates to a thermosetting plastisol dispersion composition comprising(1) poly(phenylene oxide) (PPO) in powder form, which is insoluble in the reactive plasticizer at room temperature and plasticizable at a temperature at or above the fluxing temperature;(2) a liquid reactive plasticizer member of the group consisting of (a) at least one epoxide resin having an average of more than one epoxide group in the molecule, (b) at least one liquid monomer, oligomer or prepolymer containing at least one ethylenically unsaturated group and (c) a mixture of (a) and (b); said liquid reactive plasticizer being capable of solvating the PPO at the fluxing temperature and being present in an amount ranging from 5 to 2,000 parts per 100 parts by weight of (1); and(3) 0.01 to 10% by weight of (2) of either a thermal initiator or photoinitiator for plasticizers present in the composition.The plastisol dispersion after fluxing can form a thermoset after the crosslinking reaction.

Abstract: This invention is directed to the reaction product of an O-epoxyalkylated tetrakis (hydroxyphenyl) alkane resin with a phenol, which is used either as an upper layer over a lower layer of a diazo resin in a bi-layer system or as a homogeneous mixture with a diazo resin in a mono-layer system to provide a water-developable, negative-working, lithographic printing plate.

Abstract: A UV and thermally curable composition comprising(1) a liquid, ethylenically unsaturated monomer, oligomer or prepolymer of the formula: ##STR1## wherein R is H or CH.sub.3, R.sub.1 is an organic moiety and n is at least 2,(2) a thermal initiator for (1) selected from the group consisting of substituted or unsubstituted pinacols, azo compounds, thiurams, organic peroxides and mixtures thereof,(3) a photoinitiator for (1) selected from the group consisting of aldehyde and ketone carbonyl compounds having at least one aromatic nucleus attached directly to the ##STR2## group, benzoin alkyl ethers, diethoxyacetophenone and 2,2-dimethoxy-2-phenylacetophenone,(4) a thermoplastic material, and(5) a non-polymerizable plasticizer for (4).The exposure of the composition to UV radiation under atmospheric conditions and heat in seriatim results in a cured solid product which can be utilized as adhesives, coatings, gaskets, sealants, resists and the like.

Abstract: This invention relates to a chemical method of forming an electrically conductive polymer blend which comprises impregnating a non-porous, swellable or soluble host polymer with:(a) one or more cyclic compounds selected from the group consisting of pyrrole, aniline and substituted analogues of said group members, and(b) at least one chemical oxidant selected from the group consisting of trivalent compounds, tetravalent cerium compounds, hexavalent molybdenum, tungsten or chromium compounds, divalent copper compounds, monovalent silver compounds, nitrites, quinones, peroxides and peracids, said oxidant being dissolved in a solvent capable of swelling or solubilizing said host polymer.

Abstract: A negative-working, water-developable, bilayer lithographic printing plate comprising a substrate having a hydrophilic surface which surface is first coated with a layer of a water-soluble, lithographically suitable, photosensitive, negative-working aromatic diazo composition and top coated with a layer of a water-permeable, water-insoluble, oleophilic, O-epoxyalkylated tetrakis (hydroxyphenyl) ethane resin and ester derivatives thereof. Upon imagewise exposure, the exposed areas become water insoluble, and development is effected by washing away the unexposed areas with water.

Abstract: Novel fire-retardant and hydrolysis resistant, liquid, photosensitive compositions are disclosed comprising(1) the reaction product of(a) an aliphatic unsaturation containing chlorendate, and(b) a non-ester containing polythiol, said (a) and (b) being reacted non-stoichiometrically;(2) a member of the group consisting of either (a) or (b) in an amount up to that sufficient to react with the excess of the other in (1) and a liquid acrylate monomer or oligomer, and(3) at least one photoinitiator.Acrylates or methacrylate monomers are optionally added to the composition.

Abstract: This invention relates to an electrically conductive p-doped poly(.beta.-diketone) and a process for forming same utilizing WCl.sub.6 as the polymerization catalyst. Doping of the resulting polymer with iodine dopant in either solution or the vapor phase or with tetracyanoquinodimethane (TCNQ) or AsF.sub.5 results in a conductive polymer having good stability in air.

Abstract: This invention is directed to a process and a novel composition for forming a conductive thermoset material which comprises admixing(a) particles of a polymeric material swellable at its plasticization temperature,(b) at least one liquid reactive plasticizer for (a)(c) optionally and preferably a curing agent for the reactive plasticizer, and(d) heat or electrically conductive particles,and thereafter heating the admixture for a time sufficient to flux and cure same to obtain a conductive thermoset material. Upon heating, above the plasticization temperature, the liquid reactive plasticizer plasticizes the polymer particles. This results in the swelling of the polymer particle, forcing the conductive filler to pack tightly and orderly, thereby increasing the conductivity of the plasticized conductive thermoset after curing.

Abstract: This invention is directed to a process and a novel composition for forming a conductive thermoset material which comprises admixing(a) particles of a polymeric material crosslinked to at least its gel point and swellable at its plasticization temperature,(b) at least one liquid reactive plasticizer for (a)(c) optionally and preferably a curing agent for the reactive plasticizer, and(d) heat or electrically conductive particles, and thereafter heating the admixture for a time sufficient to flux and cure same to obtain a conductive thermoset material. The crosslinking of the thermoplastic polymer can optionally be carried out in a solvent for the polymer. Upon heating, above the plasticization temperature, the liquid reactive plasticizer plasticizes the lightly crosslinked polymer particles. This results in the swelling of the polymer particle, forcing the conductive filler to pack tightly and orderly, thereby increasing the conductivity of the plasticized conductive thermoset after curing.

Abstract: This invention relates to a reactive plastisol dispersion comprising(1) a polyvinyl acetal thermoplast in particle form;(2) a liquid plasticizer member of the group consisting of(a) at least one an ethylenically unsaturated monomer, oligomer or prepolymer of the formula: ##STR1## wherein R is H or CH.sub.3, R.sub.1 is an organic moiety and n is 1 or more,(b) at least one unsaturated polyester containing the group: ##STR2## wherein R.sub.2 and R.sub.3 are organic moieties, x is 0-20 and y is 1-20; and(c) a mixture of (a) and (b); and, optionally, either(3) a free radical thermal initiator or(4) a photoinitiator for crosslinking. The reactive plastisol dispersion when fluxed can be useful as a sealant or adhesive.

Abstract: This invention relates to novel polymers of dipropargylamine and derivatives thereof, a process for preparing same and the electrically conductive polymers resulting from doping poly(dipropargylamine) and derivatives thereof.