Abstract: The present invention discloses a thermally enhanced Thin Quad Flatpack (TQFP) integrated circuit package. The invention's thermally enhanced TQFP is sufficiently thin for use in small form factor electronic systems such as Personal Computer Memory Card International Association (PCMCIA) Type III (10.5 millimeter) disk drives, modules and cards. Furthermore, the invention's thermally enhanced TQFP is reliable and has a significantly reduced thermal resistivity. Moreover, the invention does not require expensive tooling of the leadframe. Accordingly, the invention's thermally enhanced TQFP's production cost is far below that of comparable thermally enhanced packages. The invention's thermally enhanced TQFP comprises a leadframe having a number of leads. A heat spreader is attached to the bottom of the leadframe. The heat spreader extends to, and is in thermal contact with, the leads of the leadframe. This permits a larger surface for heat dissipation.