Patents Represented by Attorney, Agent or Law Firm Riovdan & McKinzie
  • Patent number: 6605238
    Abstract: Described is a compliant and crosslinkable thermal interface material of at least one silicone resin mixture, at least one wetting enhancer and at least one thermally conductive filler, and a method of making and using same; as well as a method of improving thermal conductivity of polymer and resin systems.
    Type: Grant
    Filed: January 30, 2001
    Date of Patent: August 12, 2003
    Assignee: Honeywell International Inc.
    Inventors: My Nguyen, James Grundy, Carl Edwards