Patents Represented by Attorney Rob Anderson of Intel Corporation
  • Patent number: 7316570
    Abstract: In some embodiments, an electronic circuit card includes an edge connector positioned along an edge of the electronic circuit card, wherein the edge connector includes a conductive finger on an outer layer of the electronic circuit card, and a via positioned within the conductive finger, wherein the via electrically connects the conductive finger to another layer of the electronic circuit card. In some embodiments, an electronic circuit card includes an edge connector positioned along an edge of the electronic circuit card, wherein the edge connector includes a conductive finger having a stepped shape. In some embodiments, a connector housing defines a slot, and a plurality of contacts may be disposed inside the housing and positioned along at least one side of the slot, wherein the contacts include a contact surface which is relatively wider at respective interface points on the contacts. Other embodiments are disclosed and claimed.
    Type: Grant
    Filed: December 6, 2005
    Date of Patent: January 8, 2008
    Assignee: Intel Corporation
    Inventor: Yun Ling
  • Patent number: 7316263
    Abstract: A novel cold plate may include one or more of the following features: relatively narrow channel gaps, two or more flow paths, primarily non-linear flow paths, and/or tapered channel walls.
    Type: Grant
    Filed: November 19, 2003
    Date of Patent: January 8, 2008
    Assignee: Intel Corporation
    Inventors: Steve J. Lofland, Mark A. Trautman